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BA6950FS 데이터시트(PDF) 9 Page - Rohm |
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BA6950FS 데이터시트(HTML) 9 Page - Rohm |
9 / 10 page Technical Note 9/9 BA6950FS, BA6951FS www.rohm.com 2010.02 - Rev.B © 2010 ROHM Co., Ltd. All rights reserved. 11) Testing on application boards When testing the IC on an application board, connecting a capacitor to a low impedance pin subjects the IC to stress. Therefore, always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to or removing it from the test setup during the inspection process. Ground the IC during assembly steps as an antistatic measure. Use similar precaution when transporting or storing the IC. 12) Switching of rotating direction (FWD/REV) When the rotating direction is changed over by the motor rotating condition, switch the direction after the motor is temporarily brought to the BRAKE condition or OPEN condition. It is recommended to keep the relevant conditions as follows: via BRAKE: Longer than braking time*. (* the time required for the output voltage to achieve potential below GND when brake is activated.) via OPEN: The time longer than 1 ms is recommended. 13) Regarding the input pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements, in order to keep them isolated. P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic diode or transistor. For example, the relation between each potential is as follows: When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, as well as operating malfunctions and physical damage. Therefore, do not use methods by which parasitic diodes operate, such as applying a voltage lower than the GND (P substrate) voltage to an input pin. Ordering part number B A 6 9 5 0 F S - E 2 Part No. Part No. 6950 6951 Package FS: SSOP-A16 Packaging and forming specification E2: Embossed tape and reel Resistor Transistor (NPN) N N N P + P + P P substrate GND Parasitic element Pin A N N P + P + P P substrate GND Parasitic element Pin B C B E N GND Pin A Pin B Other adjacent elements E B C GND Parasitic element Appendix: Example of monolithic IC structure Parasitic element ∗Order quantity needs to be multiple of the minimum quantity. <Tape and Reel information> Embossed carrier tape Tape Quantity Direction of feed The direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs E2 () Direction of feed Reel 1pin (Unit : mm) SSOP-A16 13 8 7 0.8 9 15 45 3 11 2 12 16 14 6 1 10 6.6 ±0.2 0.15 ±0.1 0.36 ±0.1 (MAX 6.95 include BURR) 0.1 |
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