74HC_HCT11_4

© NXP B.V. 2010. All rights reserved.

Product data sheet

Rev. 04 — 25 March 2010

10 of 15

NXP Semiconductors

74HC11; 74HCT11

Triple 3-input AND gate

Fig 10. Package outline SOT337-1 (SSOP14)

UNIT

QZ

y

w

v

θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

mm

0.21

0.05

1.80

1.65

0.25

0.38

0.25

0.20

0.09

6.4

6.0

5.4

5.2

0.65

1.25

0.2

7.9

7.6

1.03

0.63

0.9

0.7

1.4

0.9

8

0

o

o

0.13

0.1

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

SOT337-1

99-12-27

03-02-19

(1)

D

E

Z

e

c

X

A

y

1

7

14

8

θ

A

Q

detail X

L

(A )

3

MO-150

pin 1 index

0

2.5

5 mm

scale

SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm

SOT337-1

A

max.

2