74LVT_LVTH16245B_7

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© NXP B.V. 2010. All rights reserved.

Product data sheet

Rev. 07 — 29 March 2010

2 of 19

NXP Semiconductors

74LVT16245B; 74LVTH16245B

3.3 V 16-bit transceiver; 3-state

3.

Ordering information

4.

Functional diagram

Table 1.

Ordering information

Type number

Package

Temperature range

Name

Description

Version

74LVT16245BDL

−40 °C to +85 °C

SSOP48

plastic shrink small outline package; 48 leads;

body width 7.5 mm

SOT370-1

74LVTH16245BDL

74LVT16245BDGG

−40 °C to +85 °C

TSSOP48

plastic thin shrink small outline package; 48 leads;

body width 6.1 mm

SOT362-1

74LVTH16245BDGG

74LVT16245BEV

−40 °C to +85 °C

VFBGA56

plastic very thin fine-pitch ball grid array package;

56 balls; body 4.5

× 7 × 0.65 mm

SOT702-1

74LVT16245BBQ

−40 °C to +85 °C

HXQFN60U plastic thermal enhanced extremely thin quad flat

package; no leads; 60 terminals; UTLP based;

body 4

× 6 × 0.5 mm

SOT1134-1

74LVTH16245BBQ

Pin numbers are shown for SSOP48 and TSSOP48 packages only.

Fig 1.

Logic symbol

1DIR

1B0

1B1

1B2

1B3

1B4

1B5

1B6

1B7

2B0

2B1

2B2

2B3

2B4

2B5

2B6

2B7

1A0

1A1

1A2

1A3

1A4

1A5

1A6

1A7

2A0

2A1

2A2

2A3

2A4

2A5

2A6

2A7

1OE

2DIR

2OE

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