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LM3S8630-EQC50-A2 데이터시트(PDF) 18 Page - Texas Instruments |
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LM3S8630-EQC50-A2 데이터시트(HTML) 18 Page - Texas Instruments |
18 / 546 page Revision History The revision history table notes changes made between the indicated revisions of the LM3S8630 data sheet. Table 1. Revision History Description Revision Date Started tracking revision history. 2550 March 2008 2881 April 2008 ■ The ΘJA value was changed from 55.3 to 34 in the "Thermal Characteristics" table in the Operating Characteristics chapter. ■ Bit 31 of the DC3 register was incorrectly described in prior versions of the data sheet. A reset of 1 indicates that an even CCP pin is present and can be used as a 32-KHz input clock. ■ Values for IDD_HIBERNATE were added to the "Detailed Power Specifications" table in the "Electrical Characteristics" chapter. ■ The "Hibernation Module DC Electricals" table was added to the "Electrical Characteristics" chapter. ■ The TVDDRISE parameter in the "Reset Characteristics" table in the "Electrical Characteristics" chapter was changed from a max of 100 to 250. ■ The maximum value on Core supply voltage (VDD25) in the "Maximum Ratings" table in the "Electrical Characteristics" chapter was changed from 4 to 3. ■ The operational frequency of the internal 30-kHz oscillator clock source is 30 kHz ± 50% (prior data sheets incorrectly noted it as 30 kHz ± 30%). ■ A value of 0x3 in bits 5:4 of the MISC register (OSCSRC) indicates the 30-KHz internal oscillator is the input source for the oscillator. Prior data sheets incorrectly noted 0x3 as a reserved value. ■ The reset for bits 6:4 of the RCC2 register (OSCSRC2) is 0x1 (IOSC). Prior data sheets incorrectly noted the reset was 0x0 (MOSC). ■ Two figures on clock source were added to the "Hibernation Module": – Clock Source Using Crystal – Clock Source Using Dedicated Oscillator ■ The following notes on battery management were added to the "Hibernation Module" chapter: – Battery voltage is not measured while in Hibernate mode. – System level factors may affect the accuracy of the low battery detect circuit. The designer should consider battery type, discharge characteristics, and a test load during battery voltage measurements. ■ A note on high-current applications was added to the GPIO chapter: For special high-current applications, the GPIO output buffers may be used with the following restrictions. With the GPIO pins configured as 8-mA output drivers, a total of four GPIO outputs may be used to sink current loads up to 18 mA each. At 18-mA sink current loading, the VOL value is specified as 1.2 V. The high-current GPIO package pins must be selected such that there are only a maximum of two per side of the physical package or BGA pin group with the total number of high-current GPIO outputs not exceeding four for the entire package. ■ A note on Schmitt inputs was added to the GPIO chapter: Pins configured as digital inputs are Schmitt-triggered. ■ The Buffer type on the WAKE pin changed from OD to - in the Signal Tables. April 04, 2010 18 Texas Instruments-Production Data Revision History |
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