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1A

1Y

1OE

1

2

6

2A

2OE

7

5

3

2Y

Absolute Maximum Ratings

(1)

SN74AUC2G126

DUAL BUS BUFFER GATE

WITH 3-STATE OUTPUTS

SCES533C – DECEMBER 2003 – REVISED JANUARY 2007

ORDERING INFORMATION

ORDERABLE PART NUMBER

NanoFree™ – WCSP (DSBGA)

Reel of 3000

SN74AUC2G126YZPR

_ _ _UN_

0.23-mm Large Bump – YZP (Pb-free)

–40

°C to 85°C

SSOP – DCT

Reel of 3000

SN74AUC2G126DCTR

U26_ _ _

VSSOP – DCU

Reel of 3000

SN74AUC2G126DCUR

UN_

(1)

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

(2)

DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.

DCU: The actual top-side marking has one additional character that designates the assembly/test site.

YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following

character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,

• = Pb-free).

FUNCTION TABLE

(EACH BUFFER)

INPUTS

OUTPUT

Y

OE

A

H

H

H

H

L

L

L

X

Z

LOGIC DIAGRAM (POSITIVE LOGIC)

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage range

–0.5

3.6

V

–0.5

3.6

V

–0.5

3.6

V

–0.5

V

Input clamp current

–50

mA

Output clamp current

–50

mA

Continuous output current

±20

mA

±100

mA

DCT package

220

θ

JA

DCU package

227

°C/W

YZP package

102

Storage temperature range

–65

150

°C

(1)

Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.

(3)

The package thermal impedance is calculated in accordance with JESD 51-7.

2

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