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SN74AUC2G240YZPR 데이터시트(PDF) 1 Page - Texas Instruments

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부품명 SN74AUC2G240YZPR
상세설명  DUAL BUFFER/DRIVER WITH 3-STATE OUTPUTS
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제조업체  TI [Texas Instruments]
홈페이지  http://www.ti.com
Logo TI - Texas Instruments

SN74AUC2G240YZPR 데이터시트(HTML) 1 Page - Texas Instruments

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FEATURES
Seemechanicaldrawingsfordimensions.
DCTPACKAGE
(TOP VIEW)
DCUPACKAGE
(TOP VIEW)
1
V
CC
8
1OE
2
7
1A
2OE
3
6
2Y
1Y
4
5
GND
2A
3
6
1Y
2Y
8
1
V
CC
1OE
5
GND
4
2A
2
7
2OE
1A
YZP PACKAGE
(BOTTOMVIEW)
GND
5
4
2A
3 6
1Y
2Y
2 7
2OE
1A
8
V
CC
1
1OE
DESCRIPTION/ORDERING INFORMATION
SN74AUC2G240
DUAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
SCES534C – DECEMBER 2003 – REVISED JANUARY 2007
• Available in the Texas Instruments
• Low Power Consumption, 10 µA at 1.8 V
NanoFree™ Package
• ±8-mA Output Drive at 1.8 V
• Optimized for 1.8-V Operation and Is 3.6-V I/O
• Latch-Up Performance Exceeds 100 mA Per
Tolerant to Support Mixed-Mode Signal
JESD 78, Class II
Operation
• ESD Protection Exceeds JESD 22
• I
off Supports Partial-Power-Down Mode
2000-V Human-Body Model (A114-A)
Operation
200-V Machine Model (A115-A)
• Sub-1-V Operable
1000-V Charged-Device Model (C101)
• Max t
pd of 1.8 ns at 1.8 V
This dual buffer/driver is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC
operation.
The SN74AUC2G240 is designed specifically to improve the performance and density of 3-state memory
address drivers, clock drivers, and bus-oriented receivers and transmitters.
This device is organized as two 1-bit buffers/drivers with separate output-enable (OE) inputs. When OE is low,
the device passes data from the A input to the Y output. When OE is high, the outputs are in the
high-impedance state.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER
TOP-SIDE MARKING(2)
NanoFree™ – WCSP (DSBGA)
Reel of 3000
SN74AUC2G240YZPR
_ _ _UK_
0.23-mm Large Bump – YZP (Pb-free)
–40°C to 85°C
SSOP – DCT
Reel of 3000
SN74AUC2G240DCTR
U40_ _ _
VSSOP – DCU
Reel of 3000
SN74AUC2G240DCUR
UK_
(1)
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2)
DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,
• = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2003–2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.


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