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SSTUA32S865 데이터시트(PDF) 2 Page - NXP Semiconductors

부품명 SSTUA32S865
상세설명  1.8 V 28-bit 1 : 2 registered buffer with parity for DDR2-667 RDIMM applications
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제조업체  NXP [NXP Semiconductors]
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SSTUA32S865_2
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 — 16 March 2007
2 of 29
NXP Semiconductors
SSTUA32S865
1.8 V DDR2-667 registered buffer with parity
3.
Applications
I 400 MT/s to 667 MT/s high-density (for example, 2 rank by 4) DDR2 registered DIMMs
I DDR2 Registered DIMMs (RDIMM) desiring parity checking functionality
4.
Ordering information
Table 1.
Ordering information
Type number
Solder process
Package
Name
Description
Version
SSTUA32S865ET/G
Pb-free (SnAgCu solder ball
compound)
TFBGA160 plastic thin fine-pitch ball grid array package;
160 balls; body 9
× 13 × 0.8 mm
SOT802-1
SSTUA32S865ET
SnPb solder ball compound
TFBGA160 plastic thin fine-pitch ball grid array package;
160 balls; body 9
× 13 × 0.8 mm
SOT802-1


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