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2 / 29 page SSTUA32S865_2 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 02 — 16 March 2007 2 of 29 NXP Semiconductors SSTUA32S865 1.8 V DDR2-667 registered buffer with parity 3. Applications I 400 MT/s to 667 MT/s high-density (for example, 2 rank by 4) DDR2 registered DIMMs I DDR2 Registered DIMMs (RDIMM) desiring parity checking functionality 4. Ordering information Table 1. Ordering information Type number Solder process Package Name Description Version SSTUA32S865ET/G Pb-free (SnAgCu solder ball compound) TFBGA160 plastic thin fine-pitch ball grid array package; 160 balls; body 9 × 13 × 0.8 mm SOT802-1 SSTUA32S865ET SnPb solder ball compound TFBGA160 plastic thin fine-pitch ball grid array package; 160 balls; body 9 × 13 × 0.8 mm SOT802-1 |
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