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SI-7200M, SI-7230M, SI-7115B, SI-7300A,

SI-7330A, SI-7500A and SI-7502

Handling Precautions

(Note: The SI-7502 is applicable for item (2) only.)

For details, refer to the relevant product specifications.

(1) Tightening torque:

The torque to be applied in tightening screws when mounting the IC on a

heatsink should be below 49N•m.

(2) Solvent:

Do not use the following solvents:

Substances that

Chlorine-based solvents

: Trichloroethylene,

dissolve the package

Trichloroethane, etc.

Aromatic hydrogen compounds : Benzene, Toluene,

Xylene, etc.

Ketone and Acetone group solvents

Substances that

Gasoline, Benzine and Kerosene

weaken the package

(3) Silicone grease:

The silicone grease to be used between the aluminum base plate of the hybrid

IC and the heatsink should be any of the following:

• G-746

SHINETSU CHEMICAL INDUSTRIES CO., LTD.

• YG6260

TOSHIBA SILICONE CO., LTD.

• SC102

DOW CORNING TORAY SILICONE CO., LTD.

Please pay sufficient attention in selecting silicone grease since oil in some

grease may penetrate the product, which will result in an extremely short

product life.

Others

• Resistance against radiation

Resistance against radiation was not considered in the development of these ICs

because it is assumed that they will be used in ordinary environment.