전자부품 데이터시트 검색엔진 |
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ISL54225IRUZ-T7A 데이터시트(PDF) 4 Page - Intersil Corporation |
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ISL54225IRUZ-T7A 데이터시트(HTML) 4 Page - Intersil Corporation |
4 / 18 page 4 FN7627.0 July 2, 2010 Absolute Maximum Ratings Thermal Information VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6.5V VDD to Dx . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10.5V Dx to HSD1x, HSD2x . . . . . . . . . . . . . . . . . . . . . . . . .8.6V Input Voltages HSD2x, HSD1x . . . . . . . . . . . . . . . . . . . . . - 0.3V to 6.5V SEL, OE . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6.5V Output Voltages D+, D- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -5V to 6.5V Continuous Current (HSD2x, HSD1x) . . . . . . . . . . . .±40mA Peak Current (HSD2x, HSD1x) (Pulsed 1ms, 10% Duty Cycle, Max) . . . . . . . . . . ±100mA ESD Rating: Human Body Model (Tested per JESD22-A114-F) . . .>5.5kV Machine Model (Tested per JESD22-A115-A). . . . . . . >250V Charged Device Model (Tested per JESD22-C101-D) . . >2kV Latch-up Tested per JEDEC; Class II Level A . . . . . at +85°C Thermal Resistance (Typical) θJA (°C/W) θJC (°C/W) 10 Ld µTQFN Package (Note 6, 7) . 210 165 10 Ld TDFN Package (Notes 8, 9). . 58 22 Maximum Junction Temperature (Plastic Package). . +150°C Maximum Storage Temperature Range . . . -65°C to +150°C Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . .see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp Recommended Operating Conditions Temperature Range . . . . . . . . . . . . . . . . . . -40°C to +85°C VDD Supply Voltage Range . . . . . . . . . . . . . . 2.7V to 5.25V Logic Control Input Voltage . . . . . . . . . . . . . . . 0V to 5.25V Analog Signal Range VDD = 2.7V to 5.25V . . . . . . . . . . . . . . . . . . . 0V to 3.6V CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTES: 6. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 7. For θJC, the “case temp” location is taken at the package top center. 8. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech Brief TB379. 9. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside. Electrical Specifications - 2.7V to 5.25V Supply Test Conditions: VDD = +3.3V, GND = 0V, VSELH = 1.4V, VSELL = 0.5V, VOEH =1.4V, VOEL = 0.5V, (Note 10), Unless Otherwise Specified. Boldface limits apply over the operating temperature range, -40°C to +85°C. PARAMETER TEST CONDITIONS TEMP (°C) MIN (Notes 11, 12) TYP MAX (Notes 11, 12) UNITS ANALOG SWITCH CHARACTERISTICS ON-Resistance, rON (High-Speed) VDD = 2.7V, SEL = 0.5V or 1.4V, OE =0.5V, IDx = 17mA, VHSD1x or VHSD2x = 0V to 400mV (see Figure 3, Note 15) 25 - 6.5 8 Ω Full - - 10 Ω rON Matching Between Channels, ΔrON (High-Speed) VDD = 2.7V, SEL = 0.5V or 1.4V, OE =0.5V, IDx = 17mA, VHSD1x or VHSD2x = Voltage at max rON, (Notes 14, 15) 25 - 0.2 0.45 Ω Full - - 0.5 Ω rON Flatness, RFLAT(ON) (High-Speed) VDD = 2.7V, SEL = 0.5V or 1.4V, OE =0.5V, IDx = 17mA, VHSD1x or VHSD2x = 0V to 400mV, (Notes 13, 15) 25 - 0.3 0.5 Ω Full - - 1 Ω ON-Resistance, rON VDD = 3.3V, SEL = 0.5V or 1.4V, OE =0.5V, ICOMx = 17mA, VD+ or VD-= 3.3V (See Figure 4, Note 15) 25 - 12 20 Ω Full - - 25 Ω OFF Leakage Current, IHSD1x(OFF) VDD = 5.25V, SEL = VDD and OE = VDD or OE = 0V, VDx = 0.3V, 3.3V, VHSD1x =3.3V, 0.3V, VHSD2x = 0.3V, 3.3V 25 -20 1 20 nA Full - 30 - nA ON Leakage Current, IHSD1x(ON) VDD = 5.25V, SEL = OE = 0V, VDx =0.3V, 3.3V, VHSD1X = 0.3V, 3.3V, VHSD2x = 3.3V, 0.3V 25 - 2 3 µA Full - - 4 µA OFF Leakage Current, IHSD2x(OFF) VDD = 5.25V, SEL = OE = 0V or OE = VDD, VDx = 3.3V, 0.3V, VHSD2x = 0.3V, 3.3V, VHSD1X = 3.3V, 0.3V 25 -20 1 20 nA Full - 30 - nA ISL54225 |
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