2

FN7560.2

September 30, 2010

Ordering Information

PART NUMBER

(Notes 1, 2, 3)

PART

MARKING

TEMP. RANGE

(°C)

PACKAGE

(Pb-free)

PKG.

DWG. #

ISL33001IRTZ

3001

-40 to +85

8 Ld TDFN (0.65mm Pitch)

L8.3x3A

ISL33001IRT2Z

01R2

-40 to +85

8 Ld TDFN (0.5mm Pitch)

L8.3x3H

ISL33001IBZ

33001 IBZ

-40 to +85

8 Ld SOIC

M8.15

ISL33001IUZ

33001

-40 to +85

8 Ld MSOP

M8.118

ISL33002IRTZ

3002

-40 to +85

8 Ld TDFN (0.65mm Pitch)

L8.3x3A

ISL33002IRT2Z

02R2

-40 to +85

8 Ld TDFN (0.5mm Pitch)

L8.3x3H

ISL33002IUZ

33002

-40 to +85

8 Ld MSOP

M8.118

ISL33003IRTZ

3003

-40 to +85

8 Ld TDFN (0.65mm Pitch)

L8.3x3A

ISL33003IRT2Z

03R2

-40 to +85

8 Ld TDFN (0.5mm Pitch)

L8.3x3H

ISL33003IUZ

33003

-40 to +85

8 Ld MSOP

M8.118

ISL33001MSOPEVAL1Z

ISL33001 Evaluation Board

ISL33002MSOPEVAL1Z

ISL33002 Evaluation Board

ISL33003MSOPEVAL1Z

ISL33003 Evaluation Board

NOTES:

1. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach

materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both

SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that

meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.

2. Add “-T” suffix for tape and reel. Please refer to TB347 for details on reel specifications.

3. For Moisture Sensitivity Level (MSL), please see device information page for ISL33001, ISL33002, ISL33003. For more

information on MSL please see techbrief TB363.

Pin Configurations

ISL33001

(8 LD TDFN)

TOP VIEW

ISL33001

(8 LD SOIC, MSOP)

TOP VIEW

3

2

1

SCL_IN

GND 4

6

7

8

5

EN

READY

SCL_OUT

SDA_IN

SDA_OUT

PAD

6

7

8

5

3

2

1

4

GND

EN

READY

SDA_IN

SDA_OUT

SCL_IN

SCL_OUT

ISL33001, ISL33002, ISL33003