2

1

3

Ø 9.1 ± 0.2

Ø 8.1 ± 0.1

Ø 5.9 ± 0.1

5.08 ± 0.2

SURFACE

Ø 0.45

LEAD

SMP550G-FK

Prelim. 1/98

MECHANICAL DATA

Dimensions in mm.

P.I.N. PHOTODIODE

DESCRIPTION

The SMP550G-FK is a Silicon P.I.N. photodiode incorporated

in a hermetic metal can package. The package window has

greater ultra-violet light transmission, thus extending the useful

spectral range of the device. The electrical terminations are via

two leads of diameter 0.018" on pitch centre diameter of 0.2". The

photodiode is electrically isolated from the package, which has a

separate earth lead.

The larger photodiode active area provides greater sensitivity

than the SMP400 range of devices, with a corresponding

reduction in speed. The photodiode structure has been optimised

for high sensitivity, light measurement applications across the

infra-red to ultra-violet spectrum. Inclusion of a suitable optical

filter into the package can produce a device that responds only to

ultra-violet light. The metal can, isolated photodiode and optional

screening mesh ensure a rugged device with a high degree of

immunity to conducted and radiated electrical interference.

TO-39 Package

Operating temperature range

Storage temperature range

Temperature coefficient of responsively

Temperature coefficient of dark current

Reverse breakdown voltage

-40°C to +70°C

-45°C to +80°C

0.35% per °C

x2 per 8°C rise

60V

FEATURES

• WIDEST SPECTRAL RESPONSE

• ENHANCED UV SENSITIVITY

• PHOTODIODE ISOLATED FROM PACKAGE

• EXCELLENT LINEARITY

• LOW NOISE

• LOW LEAKAGE CURRENT

• · LOW CAPACITANCE

• INTEGRAL OPTICAL FILTER OPTION note 1

• TO39 HERMETIC METAL CAN PACKAGE

• EMI SCREENING MESH AVAILABLE

Note 1 Contact Semelab Plc for filter options

Pin 1 – Anode

Pin 2 – Cathode

Pin 3 – Case