전자부품 데이터시트 검색엔진 |
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MC-7832-HA 데이터시트(PDF) 4 Page - NEC |
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MC-7832-HA 데이터시트(HTML) 4 Page - NEC |
4 / 6 page Data Sheet PG10685EJ01V0DS 4 MC-7832-HA NOTES ON CORRECT USE (1) The space between PC board and root of the lead should be kept more than 1 mm to prevent undesired stress to the lead and also should be kept less than 4 mm to prevent undesired parasitic inductance. Recommended that space is 2.0 to 3.0 mm typical. (2) Recommended torque strength of the screw is 59 to 78 Ncm. (3) Form the ground pattern as wide as possible to minimize ground impedance. (to prevent undesired oscillation) All the ground pins must be connected together with wide ground pattern to decrease impedance difference. RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Soldering Conditions Recommended Condition Symbol Pin Part Heating Pin area temperature (pin temperature) : 350 °C or below Note Soldering time (per pin of device) : 3 seconds or less − Note The point of pin part heating must be kept more than 1.2 mm distance from the root of lead. |
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유사한 설명 - MC-7832-HA |
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