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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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FAN2560UC13X 데이터시트(PDF) 8 Page - Fairchild Semiconductor |
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FAN2560UC13X 데이터시트(HTML) 8 Page - Fairchild Semiconductor |
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8 / 11 page  © 2006 Fairchild Semiconductor Corporation www.fairchildsemi.com FAN2560 • Rev. 1.0.1 8 Application Information ENABLE Latch A pull-down resistor latches the LOW state of the EN input after this input is externally forced LOW. A low- side switch turns ON a 370 k Ω pull-down resistance to keep the EN in LOW state, even if the EN input is subsequently left floating. Soft-Start A soft-start function prevents an excessive input current flow during start-up. When the LDO is enabled, the soft- start circuit limits the peak inrush current below the specified maximum value, which increases when COUT increases. To further reduce the peak inrush current, the output capacitance may be lowered to 1µF, taking advantage of FAN2560 stability over a wide range of COUT capacitance. Short-Circuit and Thermal Protection The FAN2560 output current voltage characteristic has a fold-back shape that indicates a short-circuit current limit lower than the maximum load current. Although the short-circuit current is limited to below 500mA, the device can supply high peak output currents of up to 1A for brief periods. However, this output overload may cause the die temperature to increase and exceed maximum ratings due to power dissipation. In such cases, depending upon the ambient temperature, VIN, load current, and the junction-to-air thermal resistance (θJA) of the die, the device may enter thermal shutdown. During output overload conditions, when the die temperature exceeds the shutdown limit temperature of 150°C, the onboard thermal protection disables the output until the temperature drops below this limit, at which point the output is re-enabled. Thermal Considerations For best performance, the die temperature and the power dissipated should be kept at moderate values. The maximum power dissipated can be evaluated based on the following relationship: ⎭ ⎬ ⎫ ⎩ ⎨ ⎧ Θ − = JA A (max) J (max) D T T P (1) where TJ(max) is the maximum allowable junction temperature of the die, which is 125°C, and TA is the ambient operating temperature. θJA is dependent on the surrounding PCB layout and can be improved by providing a heat sink of surrounding copper ground. The addition of backside copper with through-holes, stiffeners, and other enhancements can also aid in reducing θJA. The heat contributed by the dissipation of other devices located nearby must be included in design considerations. Reverse Current Path During normal operation, VIN is higher than VOUT and the parasitic diode for the series power FET is reverse biased. If the output voltage is externally forced above the input voltage, the parasitic diode gets forward biased and starts to conduct. In this case, it is necessary to limit the reverse current to maximum 100mA to avoid adversely affecting reliability. Capacitors Selection The FAN2560 is stable with a wide range of ceramic output capacitors. An output capacitor of at least 0.7µF effective capacitance and the minimum ESR over the frequency range of 3 to 300m Ω is required to ensure stability over the full range of supply voltages and load currents. High-ESR tantalum or electrolytic capacitors may be used, but a low ESR ceramic capacitor has to be connected in parallel at the output, at a distance no more than 1-inch from the VOUT pin. The MLCC capacitors indicated in Table 1 have been successfully tested with the FAN2560. Table 1. Recommended Capacitors Capacitance Size Vendor Part number 1 μF 0603 MURATA GRM188R71C105KA120 2.2 μF 0603 MURATA GRM188R61A225KF340 2.2 μF 0402 MURATA GRM155R60J225ME15 |
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