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5 / 24 page L6230 Electrical data Doc ID 18094 Rev 2 5/24 2.3 Thermal data Table 4. Thermal data Symbol Parameter Value Unit PowerSO36 QFN32 Rth(j-amb)1 Maximum thermal resistance junction-ambient (1) 1. Mounted on a multi-layer FR4 PCB with a dissipating copper surface on the top side of 6 cm2 (with a thickness of 35 µm). 36 - °C/W Rth(j-amb)1 Maximum thermal resistance junction-ambient (2) 2. Mounted on a multi-layer FR4 PCB with a dissipating copper surface on the top side of 6 cm2 (with a thickness of 35 µm), 16 via holes and a ground layer. 16 - °C/W Rth(j-amb)2 Maximum thermal resistance junction-ambient (3) 3. Mounted on a multi-layer FR4 PCB without any heat-sinking surface on the board. 63 - °C/W Rth(j-amb)3 Maximum thermal resistance junction-ambient (4) 4. Mounted on a double-layer FR4 PCB with a dissipating copper surface of 0.5 cm2 on the top side plus 6 cm2 ground layer connected through 18 via holes (9 below the IC). -42 °C/W |
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