전자부품 데이터시트 검색엔진 |
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ISL28107FRTZ 데이터시트(PDF) 6 Page - Intersil Corporation |
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ISL28107FRTZ 데이터시트(HTML) 6 Page - Intersil Corporation |
6 / 32 page 6 FN6631.3 September 9, 2010 Absolute Maximum Ratings Thermal Information Maximum Supply Voltage . . . . . . . . . . . . . . . . . . . . . . 42V Maximum Differential Input Current . . . . . . . . . . . . . 20mA Maximum Differential Input Voltage . . . (V-) - 0.5V to (V+) + 0.5V Min/Max Input Voltage . . . . . . . . (V-) - 0.5V to (V+) + 0.5V Max/Min Input Current for Input Voltage >V+ or <V- . . . . ±20mA Output Short-Circuit Duration (1 Output at a Time) . . . Indefinite ESD Tolerance Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . 4.5kV Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . . . 500V Charged Device Model . . . . . . . . . . . . . . . . . . . . . . 1.5kV Thermal Resistance (Typical) θJA (°C/W) θJC (°C/W) 8 Ld SOIC (ISL28107, Notes 4, 5) . . . 120 60 8 Ld SOIC (ISL28207, Notes 4, 5) . . . 105 50 8 Ld MSOP (ISL28107, Notes 4, 5) . . 155 50 8 Ld TDFN (ISL28107, Notes 6, 7) . 48 7 8 Ld TDFN (ISL28207, Notes 6, 7) . 43 2 14 Ld SOIC (ISL28407) . . . . . . . . TBD TBD 14 Ld TSSOP (ISL28407) . . . . . . . TBD TBD 16 Ld QFN (ISL28407) . . . . . . . . . TBD TBD Storage Temperature Range . . . . . . . . . . . -65°C to +150°C Pb-Free Reflow Profile. . . . . . . . . . . . . . . . . . see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp Operating Conditions Ambient Operating Temperature Range. . . . -40°C to +125°C Maximum Operating Junction Temperature . . . . . . . +150°C CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTES: 4. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 5. For θJC, the “case temp” location is taken at the package top center. 6. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech Brief TB379. 7. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside. IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typical values are for information purposes only. Unless otherwise noted, all tests are at the specified temperature and are pulsed tests, therefore: TJ = TC = TA Electrical Specifications VS ±15V, VCM = 0, VO = 0V, RL = Open, TA= +25°C, unless otherwise noted. Boldface limits apply over the operating temperature range, -40°C to +125°C. Temperature data established by characterization. PARAMETER DESCRIPTION CONDITIONS MIN (Note 8) TYP MAX (Note 8) UNIT VOS Offset Voltage Magnitude; SOIC Package -75 5 75 µV -140 140 µV Offset Voltage Magnitude; MSOP Package -100 5 100 µV -180 180 µV Offset Voltage Magnitude; TDFN Package ISL28107 -100 10 100 µV -190 190 µV ISL28207 -100 10 100 µV -175 175 µV TCVOS Offset Voltage Drift; SOIC Package -0.65 0.1 0.65 µV/°C Offset Voltage Drift; MSOP Package -0.85 0.1 0.85 µV/°C Offset Voltage Drift; TDFN Package ISL28107 -0.9 0.1 0.9 µV/°C ISL28207 -0.75 0.1 0.75 µV/°C IB Input Bias Current TA = -40°C to +85°C -300 15 300 pA TA = -40°C to +125°C -600 600 pA ISL28107, ISL28207, ISL28407 |
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