ISL29028A

11

FN7721.2

March 24, 2011

Typical Circuit

A typical application for the ISL29028A is shown in Figure 5. The

Soldering Considerations

Convection heating is recommended for reflow soldering; direct-

infrared heating is not recommended. The plastic ODFN package

does not require a custom reflow soldering profile, and is qualified to

+260°C. A standard reflow soldering profile with a +260°C

maximum is recommended.

Suggested PCB Footprint

It is important that users check the “Surface Mount Assembly

Guidelines for Optical Dual FlatPack No Lead (ODFN) Package”

before starting ODFN product board mounting.

(http://www.intersil.com/data/tb/TB477.pdf)

Layout Considerations

devices, it is intended to provide excellent performance even in

significantly noisy environments. There are only a few

considerations that will ensure best performance.

noise. A 0.1µF and 1µF power supply decoupling capacitors need to be

placed close to the device.

ALS Sensor Window Layout

Special care should be taken to ensure that the sensor, as

outlined in the sensor location outline, is uniformly illuminated.

Shadows that result from off angle window openings that affect

that uniform illumination can affect the measurement results.

ADDR0

1

GND

3

REXT

4

SDA

INT

7

IRDR

8

ISL29028A

R1

10kΩ

R2

10kΩ

REXT

499kΩ

MICROCONTROLLER

INT

SDA

SLAVE_0

SLAVE_1

SCL

SDA

SCL

SDA

6

R3

10kΩ

SCL

2

VDD

5

C2

0.1µF

FIGURE 5. ISL29028A TYPICAL CIRCUIT

SCL

C1

1µF