전자부품 데이터시트 검색엔진 |
|
BA2902YF-C 데이터시트(PDF) 11 Page - Rohm |
|
BA2902YF-C 데이터시트(HTML) 11 Page - Rohm |
11 / 17 page Technical Note 11/16 BA2904YF-C,BA2904YFVM-C,BA2902YF-C,BA2902YFV-C www.rohm.com 2011.08 - Rev.B © 2011 ROHM Co., Ltd. All rights reserved. 0 200 400 600 800 1000 0 25 50 75 100 125 150 AMBIENT TEMPERATURE [℃] 0 200 400 600 800 1000 0 25 50 75 100 125 150 AMBIENT TEMPERATURE [℃] ● Derating curves Power dissipation(total loss) indicates the power that can be consumed by IC at Ta=25℃(normal temperature). IC is heated when it consumed power, and the temperature of IC chip becomes higher than ambient temperature. The temperature that can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited. Power dissipation is determined by the temperature allowed in IC chip(maximum junction temperature) and thermal resistance of package(heat dissipation capability). The maximum junction temperature is typically equal to the maximum value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead frame of the package. The parameter which indicatesthis heat dissipation capability(hardness of heat release)is called thermal resistance, represented by the symbol θja[℃/W].The temperature of IC inside the package can be estimated by this thermal resistance. Fig.54(a) shows the model of thermal resistance of the package. Thermal resistance θja, ambient temperature Ta, junction temperature Tj, and power dissipation Pd can be calculated by the equation below: θja = (Tj-Ta) / Pd [℃/W] ・・・・・ (Ⅰ) Derating curve in Fig.54(b) indicates power that can be consumed by IC with reference to ambient temperature.Power that can be consumed by IC begins to attenuate at certain ambient temperature. This gradient iis determined by thermal resistance θja. Thermal resistance θja depends on chip size, power consumption, package,ambient temperature, package condition, wind velocity, etc even when the same of package is used. Thermal reduction curve indicates a reference value measured at a specified condition. Fig.55(c),(d) show a derating curve for an example of BA2904Y, BA2902Y. (*6) (*7) (*8) (*9) Unit 6.2 4.8 7.0 4.9 [mW/℃] When using the unit above Ta=25[℃], subtract the value above per degree [℃]. Permissible dissipation is the value when FR4 glass epoxy board 70[mm]×70[mm]×1.6[mm](cooper foil area below 3[%]) is mounted. Fig. 55 Derating curve (a) Thermal resistance (b) Derating curve Fig. 54 Thermal resistance and derating θja = ( Tj ーTa ) / Pd [℃/W] 0 50 75 100 125 150 25 P1 P2 Pd (max) LSIの消費電力 [W] θ' ja2 θ' ja1 Tj ' (max) θja2 < θja1 周囲 温度 Ta [℃ ] θ ja2 θ ja1 Tj (max) 周囲温度 Ta [℃] チップ 表面温度 Tj [℃] 消費電力 P [W] Ambient temperature Chip surface temperature Power dissipation Pd[W] Power dissipation of LSI Ambient temperature (c) BA2904Y family (d) BA2902Y family BA2904YF-C BA2904YFVM-C BA2902YFV-C BA2902YF-C 780mW(*6) 590mW(*7) 870mW(*8) 610mW(*9) |
유사한 부품 번호 - BA2902YF-C |
|
유사한 설명 - BA2902YF-C |
|
|
링크 URL |
개인정보취급방침 |
ALLDATASHEET.CO.KR |
ALLDATASHEET 가 귀하에 도움이 되셨나요? [ DONATE ] |
Alldatasheet는? | 광고문의 | 운영자에게 연락하기 | 개인정보취급방침 | 링크교환 | 제조사별 검색 All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |