AN811

Vishay Siliconix

www.vishay.com

2

Document Number: 71126

12-Dec-03

Front of Board

FIGURE 3.

Back of Board

vishay.com

ChipFETr

THERMAL PERFORMANCE

Junction-to-Foot Thermal Resistance

(the Package Performance)

Thermal performance for the 1206-8 ChipFET measured as

junction-to-foot thermal resistance is 15_C/W typical, 20_C/W

maximum for the single device. The “foot” is the drain lead of

the device as it connects with the body. This is identical to the

shortening the leads to the point where they become only a

small part of the total footprint area.

Junction-to-Ambient Thermal Resistance

(dependent on pcb size)

80_C/W steady state, compared with 68_C/W for the SO-8.

Maximum ratings are 95_C/W for the 1206-8 versus 80_C/W

for the SO-8.

Testing

To aid comparison further, Figure 4 illustrates ChipFET 1206-8

thermal performance on two different board sizes and three

different pad patterns. The results display the thermal

performance out to steady state and produce a graphic

account of how an increased copper pad area for the drain

connections can enhance thermal performance. The

ChipFET are :

1) Minimum recommended pad pattern (see

Figure 2) on the evaluation board size of

0.5 in x 0.6 in.

156_C/W

2) The evaluation board with the pad pattern

described on Figure 3.

111_C/W

3) Industry standard 1” square pcb with

maximum copper both sides.

78_C/W

The results show that a major reduction can be made in the

thermal resistance by increasing the copper drain area. In this

example, a 45_C/W reduction was achieved without having to

increase the size of the board. If increasing board size is an

option, a further 33_C/W reduction was obtained by

maximizing the copper from the drain on the larger 1” square

pcb.

Time (Secs)

FIGURE 4. Single 1206−8 ChipFET

0

1

160

40

80

100

1000

120

10

1” Square PCB

Single EVB

Min. Footprint

SUMMARY

The thermal results for the single-channel 1206-8 ChipFET

package display similar power dissipation performance to the

SO-8 with a footprint reduction of 80%. Careful design of the

package has allowed for this performance to be achieved. The

short leads allow the die size to be maximized and thermal

resistance to be reduced within the confines of the TSOP-6

body size.

ASSOCIATED DOCUMENT

1206-8 ChipFET Dual Thermal performance, AN812