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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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SST32HF201 데이터시트(PDF) 7 Page - Silicon Storage Technology, Inc |
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SST32HF201 데이터시트(HTML) 7 Page - Silicon Storage Technology, Inc |
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7 / 26 page  Preliminary Specifications Multi-Purpose Flash (MPF) + SRAM ComboMemory SST32HF201 / SST32HF202 / SST32HF401 / SST32HF402 7 ©2001 Silicon Storage Technology, Inc. S71209-00-000 9/01 557 TABLE 4: SOFTWARE COMMAND SEQUENCE Command Sequence 1st Bus Write Cycle 2nd Bus Write Cycle 3rd Bus Write Cycle 4th Bus Write Cycle 5th Bus Write Cycle 6th Bus Write Cycle Addr1 Data Addr1 Data Addr1 Data Addr1 Data Addr1 Data Addr1 Data Word-Program 5555H AAH 2AAAH 55H 5555H A0H WA2 Data Sector-Erase 5555H AAH 2AAAH 55H 5555H 80H 5555H AAH 2AAAH 55H SAX3 30H Block-Erase 5555H AAH 2AAAH 55H 5555H 80H 5555H AAH 2AAAH 55H BAX3 50H Chip-Erase 5555H AAH 2AAAH 55H 5555H 80H 5555H AAH 2AAAH 55H 5555H 10H Software ID Entry4,5 5555H AAH 2AAAH 55H 5555H 90H Software ID Exit XXH F0H Software ID Exit 5555H AAH 2AAAH 55H 5555H F0H T4.1 557 1. Address format A14-A0 (Hex),Address A15 can be VIL or VIH, but no other value, for the Command sequence. 2. WA = Program Word address 3. SAX for Sector-Erase; uses AMS-A11 address lines BAX for Block-Erase; uses AMS-A15 address lines AMS = Most significant address AMS = A16 for SST32HF201/202 and A17 for SST32HF401/402 4. The device does not remain in Software Product ID mode if powered down. 5. With AMS-A1 = 0; SST Manufacturer’s ID = 00BFH, is read with A0 = 0, SST32HF201/202 Device ID = 2789H, is read with A0 = 1, SST32HF401/402 Device ID = 2780H, is read with A0 = 1. Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute Maximum Stress Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these conditions or conditions greater than those defined in the operational sections of this data sheet is not implied. Exposure to absolute maximum stress rating conditions may affect device reliability.) Operating Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -20°C to +85°C Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +125°C D. C. Voltage on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to VDD+0.3V Transient Voltage (<20 ns) on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -2.0V to VDD+2.0V Package Power Dissipation Capability (Ta = 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0W Surface Mount Lead Soldering Temperature (3 Seconds) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 240°C Output Short Circuit Current1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA 1. Outputs shorted for no more than one second. No more than one output shorted at a time. OPERATING RANGE Range Ambient Temp VDD Commercial 0°C to +70°C 2.7-3.3V Extended -20°C to +85°C 2.7-3.3V AC CONDITIONS OF TEST Input Rise/Fall Time . . . . . . . . . . . . . . . 5 ns Output Load . . . . . . . . . . . . . . . . . . . . . CL = 30 pF See Figures 15 and 16 |
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