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SST34HF1681-90-4C-L1P 데이터시트(PDF) 2 Page - Silicon Storage Technology, Inc |
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SST34HF1681-90-4C-L1P 데이터시트(HTML) 2 Page - Silicon Storage Technology, Inc |
2 / 30 page 2 Advance Specifications 16 Mbit Concurrent SuperFlash + 8 Mbit SRAM ComboMemory SST34HF1681 ©2001 Silicon Storage Technology, Inc. S71214-00-000 12/01 561 SRAM bank enable signal, BES1# and BES2, selects the SRAM bank. The flash memory bank enable signal, BEF#, has to be used with Software Data Protection (SDP) com- mand sequence when controlling the Erase and Program operations in the flash memory bank. The memory banks are superimposed in the same memory address space where they share common address lines, data lines, WE# and OE# which minimize power consumption and area. Designed, manufactured, and tested for applications requir- ing low power and small form factor, the SST34HF1681 are offered in both commercial and extended temperatures and a small footprint package to meet board space con- straint requirements. Device Operation The SST34HF1681 uses BES1#, BES2 and BEF# to con- trol operation of either the flash or the SRAM memory bank. When BEF# is low, the flash bank is activated for Read, Program or Erase operation. When BES1# is low, and BES2 is high the SRAM is activated for Read and Write operation. BEF# and BES1# cannot be at low level, and BES2 cannot be at high level at the same time. If all bank enable signals are asserted, bus contention will result and the device may suffer permanent damage. All address, data, and control lines are shared by flash and SRAM memory banks which minimizes power consump- tion and loading. The device goes into standby when BEF# and BES1# bank enables are raised to VIHC (Logic High) or when BEF# is high and BES2 is low. Concurrent Read/Write Operation Dual bank architecture of SST34HF1681 devices allows the Concurrent Read/Write operation whereby the user can read from one bank while program or erase in the other bank. This operation can be used when the user needs to read system code in one bank while updating data in the other bank. See Figure 1 for Dual-Bank Memory Organization. Note: For the purposes of this table, write means to Block-, Sector, or Chip-Erase, or Word-Program as applicable to the appropriate bank. Flash Read Operation The Read operation of the SST34HF1681 is controlled by BEF# and OE#, both have to be low for the system to obtain data from the outputs. BEF# is used for device selection. When BEF# is high, the chip is deselected and only standby power is consumed. OE# is the output control and is used to gate data from the output pins. The data bus is in high impedance state when either BEF# or OE# is high. Refer to the Read cycle timing diagram for further details (Figure 6). Flash Word-Program Operation The SST34HF1681 are programmed on a word-by-word basis. Before Program operations, the memory must be erased first. The Program operation consists of three steps. The first step is the three-byte load sequence for Software Data Protection. The second step is to load word address and word data. During the Word-Program operation, the addresses are latched on the falling edge of either BEF# or WE#, whichever occurs last. The data is latched on the ris- ing edge of either BEF# or WE#, whichever occurs first. The third step is the internal Program operation which is ini- tiated after the rising edge of the fourth WE# or BEF#, whichever occurs first. The Program operation, once initi- ated, will be completed typically within 10 µs. See Figures 7 and 8 for WE# and BEF# controlled Program operation tim- ing diagrams and Figure 21 for flowcharts. During the Pro- gram operation, the only valid reads are Data# Polling and Toggle Bit. During the internal Program operation, the host is free to perform additional tasks. Any commands issued during the internal Program operation are ignored. CONCURRENT READ/WRITE STATE TABLE Flash SRAM Bank 1 Bank 2 Read Write No Operation Write Read No Operation Write No Operation Read No Operation Write Read Write No Operation Write No Operation Write Write |
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