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SST29LE010-70-4C-NH 데이터시트(PDF) 2 Page - Silicon Storage Technology, Inc |
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SST29LE010-70-4C-NH 데이터시트(HTML) 2 Page - Silicon Storage Technology, Inc |
2 / 26 page 2 Data Sheet 1 Mbit Page-Mode EEPROM SST29EE010 / SST29LE010 / SST29VE010 ©2001 Silicon Storage Technology, Inc. S71061-07-000 6/01 304 Read The Read operations of the SST29EE/LE/VE010 are con- trolled by CE# and OE#, both have to be low for the system to obtain data from the outputs. CE# is used for device selection. When CE# is high, the chip is deselected and only standby power is consumed. OE# is the output control and is used to gate data from the output pins. The data bus is in high impedance state when either CE# or OE# is high. Refer to the read cycle timing diagram for further details (Figure 4). Write The Page-Write to the SST29EE/LE/VE010 should always use the JEDEC Standard Software Data Protection (SDP) three-byte command sequence. The SST29EE/LE/VE010 contain the optional JEDEC approved Software Data Pro- tection scheme. SST recommends that SDP always be enabled, thus, the description of the Write operations will be given using the SDP enabled format. The three-byte SDP Enable and SDP Write commands are identical; therefore, any time a SDP Write command is issued, Soft- ware Data Protection is automatically assured. The first time the three-byte SDP command is given, the device becomes SDP enabled. Subsequent issuance of the same command bypasses the data protection for the page being written. At the end of the desired Page-Write, the entire device remains protected. For additional descriptions, please see the application notes, The Proper Use of JEDEC Standard Software Data Protection and Protecting Against Unintentional Writes When Using Single Power Supply Flash Memories. The Write operation consists of three steps. Step 1 is the three-byte load sequence for Software Data Protection. Step 2 is the byte-load cycle to a page buffer of the SST29EE/LE/VE010. Steps 1 and 2 use the same timing for both operations. Step 3 is an internally controlled write cycle for writing the data loaded in the page buffer into the memory array for nonvolatile storage. During both the SDP three-byte load sequence and the byte-load cycle, the addresses are latched by the falling edge of either CE# or WE#, whichever occurs last. The data is latched by the ris- ing edge of either CE# or WE#, whichever occurs first. The internal write cycle is initiated by the TBLCO timer after the rising edge of WE# or CE#, whichever occurs first. The Write cycle, once initiated, will continue to completion, typi- cally within 5 ms. See Figures 5 and 6 for WE# and CE# controlled Page-Write cycle timing diagrams and Figures 15 and 17 for flowcharts. The Write operation has three functional cycles: the Soft- ware Data Protection load sequence, the page load cycle, and the internal write cycle. The Software Data Protection consists of a specific three-byte load sequence that allows writing to the selected page and will leave the SST29EE/ LE/VE010 protected at the end of the Page-Write. The page load cycle consists of loading 1 to 128 bytes of data into the page buffer. The internal write cycle consists of the TBLCO time-out and the write timer operation. During the Write operation, the only valid reads are Data# Polling and Toggle Bit. The Page-Write operation allows the loading of up to 128 bytes of data into the page buffer of the SST29EE/LE/ VE010 before the initiation of the internal write cycle. Dur- ing the internal write cycle, all the data in the page buffer is written simultaneously into the memory array. Hence, the Page-Write feature of SST29EE/LE/VE010 allow the entire memory to be written in as little as 5 seconds. During the internal write cycle, the host is free to perform additional tasks, such as to fetch data from other locations in the sys- tem to set up the write to the next page. In each Page-Write operation, all the bytes that are loaded into the page buffer must have the same page address, i.e. A7 through A16. Any byte not loaded with user data will be written to FFH. See Figures 5 and 6 for the Page-Write cycle timing dia- grams. If after the completion of the three-byte SDP load sequence or the initial byte-load cycle, the host loads a sec- ond byte into the page buffer within a byte-load cycle time (TBLC) of 100 µs, the SST29EE/LE/VE010 will stay in the page load cycle. Additional bytes are then loaded consecu- tively. The page load cycle will be terminated if no addi- tional byte is loaded into the page buffer within 200 µs (TBLCO) from the last byte-load cycle, i.e., no subsequent WE# or CE# high-to-low transition after the last rising edge of WE# or CE#. Data in the page buffer can be changed by a subsequent byte-load cycle. The page load period can continue indefinitely, as long as the host continues to load the device within the byte-load cycle time of 100 µs. The page to be loaded is determined by the page address of the last byte loaded. Software Chip-Erase The SST29EE/LE/VE010 provide a Chip-Erase operation, which allows the user to simultaneously clear the entire memory array to the “1” state. This is useful when the entire device must be quickly erased. The Software Chip-Erase operation is initiated by using a specific six-byte load sequence. After the load sequence, the device enters into an internally timed cycle similar to the Write cycle. During the Erase operation, the only valid read is Toggle Bit. See Table 4 for the load sequence, Figure 10 for timing diagram, and Figure 19 for the flowchart. |
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