– 10 –

CXA1211M

Package Outline

Unit: mm

PACKAGE STRUCTURE

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

PACKAGE MASS

EPOXY RESIN

SOLDER/PALLADIUM

42/COPPER ALLOY

0.1g

SOP-8P-L03

SOP008-P-0225

8PIN SOP (PLASTIC)

SONY CODE

EIAJ CODE

JEDEC CODE

0° to 10°

0.1 – 0.1

+ 0.15

DETAILA

8

5

1

4

1.27

1.25 – 0.15

+ 0.4

A

5.0 – 0.1

+ 0.4

0.10

PLATING

M

0.24

b

B

(0.4)

b = 0.4 – 0.05

DETAIL B : SOLDER

b = 0.4 ± 0.03

DETAIL B : PALLADIUM

+ 0.1

NOTE : PALLADIUM PLATING

This product uses S-PdPPF (Sony Spec.-Palladium Pre-Plated Lead Frame).