전자부품 데이터시트 검색엔진 |
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FMBT5401 데이터시트(PDF) 8 Page - Formosa MS |
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FMBT5401 데이터시트(HTML) 8 Page - Formosa MS |
8 / 9 page Reel packing SOT-23 3,000 4.0 30,000 183*183*123 178 382*262*387 240,000 11.6 PACKAGE REEL SIZE REEL COMPONENT SPACING BOX INNER BOX REEL DIA, CARTON SIZE CARTON APPROX. GROSS WEIGHT (kg) (pcs) (m/m) (m/m) (m/m) (pcs) (m/m) (pcs) 7" Formosa MS Page 8 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Issued Date Revised Date Revision Page. FMBT5401 Profile Feature Soldering Condition Average ramp-up rate(TL to TP) <3 /sec Preheat o -Temperature Min(Tsmin) 150 C o -Temperature Max(Tsmax) 200 C -Time(min to max)(ts) 60~120sec Tsmax to TL o -Ramp-upRate <3 C/sec Time maintained above: o -Temperature(TL) 217 C -Time(tL) 60~260sec o o Peak Temperature(TP) 255 C-0/+5 C o Time within 5 C of actual Peak Temperature(tP) o Ramp-down Rate <6 C/sec o Time 25 C to Peak Temperature <6minutes oC 3.Reflow soldering 10~30sec 1.Storage environment: Temperature=5 ~40 Humidity=55%±25% 2.Reflow soldering of surface-mount devices o o C C Suggested thermal profiles for soldering processes Critical Zone TL to TP TL Tsmax Tsmin Ramp-up Tp tS Preheat o t25 C to Peak Time 25 TL TP Ramp-down High Voltage Transistor PNP Silicon DS-231166 2011/01/05 2011/07/21 B 9 |
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