Package Outline

Unit : mm

CXA1846AM/AN

—10—

CXA1846AM

SONY CODE

EIAJ CODE

JEDEC CODE

SOP-20P-L01

SOP020-P-0300

PACKAGE STRUCTURE

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

PACKAGE MASS

COPPER ALLOY

SOLDER PLATING

EPOXY RESIN

0.3g

20PIN SOP (PLASTIC)

12.45 – 0.1

+ 0.4

20

11

0.45 ± 0.1

1.27

10

1

0.2 – 0.05

+ 0.1

0.1 – 0.05

+ 0.2

1.85 – 0.15

+ 0.4

0.15

0.24

M

CXA1846AN

20PIN SSOP (PLASTIC)

SONY CODE

EIAJ CODE

JEDEC CODE

PACKAGE STRUCTURE

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

PACKAGE MASS

EPOXY RESIN

SOLDER / PALLADIUM

42/COPPER ALLOY

0.1g

SSOP-20P-L01

SSOP020-P-0044

PLATING

0.1 ± 0.1

0° to 10°

DETAIL A

NOTE: Dimension “

∗” does not include mold protrusion.

b=0.22 – 0.05

+ 0.1

(0.22)

DETAIL B : SOLDER

DETAIL B : PALLADIUM

b=0.22 ± 0.03

∗6.5 ± 0.1

0.65

20

11

10

1

A

0.1

1.25 – 0.1

+ 0.2

0.13 M

b

NOTE : PALLADIUM PLATING

This product uses S-PdPPF (Sony Spec.-Palladium Pre-Plated Lead Frame).