© 2009 Fairchild Semiconductor Corporation

www.fairchildsemi.com

FAN5701 • Rev. 1.0.3

10

Physical Dimensions

BOTTOM VIEW

SIDE VIEWS

TOP VIEW

RECOMMENDED LAND PATTERN

BALL A1

INDEX AREA

1 2 3 4

A

B

C

D

SEATING

PLANE

16X

A1

0.005

CA B

F

(NSMD PAD TYPE)

Ø0.260±0.02

0.40

0.40

(X) ±0.018

(Y) ±0.018

0.625

0.547

0.06 C

0.05 C

E

D

F

0.378±0.018

0.208±0.021

NOTES:

A. NO JEDEC REGISTRATION APPLIES.

B. DIMENSIONS ARE IN MILLIMETERS.

C. DIMENSIONS AND TOLERANCE

PER ASME Y14.5M, 1994.

D. DATUM C IS DEFINED BY THE SPHERICAL

CROWNS OF THE BALLS.

E. PACKAGE NOMINAL HEIGHT IS 586 MICRONS

±39 MICRONS (547-625 MICRONS).

F. FOR DIMENSIONS D, E, X, AND Y SEE

PRODUCT DATASHEET.

G. DRAWING FILNAME: MKT-UC016AArev2.

0.03 C

2X

0.03 C

2X

E

D

B

C

A

0.40

0.40

(Ø0.20)

Cu Pad

(Ø0.30) Solder

Mask Opening

Figure 16. Wafer-Level Chip-Scale Package (WLCSP)

Product-Specific Dimensions

Product

D

E

X

Y

FAN5701UCxx

1.610mm

1.610mm

0.205mm

0.205mm

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