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AD5323BRU 데이터시트(PDF) 5 Page - Analog Devices |
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AD5323BRU 데이터시트(HTML) 5 Page - Analog Devices |
5 / 18 page REV. 0 AD5303/AD5313/AD5323 –5– CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD5303/AD5313/AD5323 features proprietary ESD protection circuitry, perma- nent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. WARNING! ESD SENSITIVE DEVICE ABSOLUTE MAXIMUM RATINGS 1, 2 (TA = +25 °C unless otherwise noted) VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V Digital Input Voltage to GND . . . . . . . –0.3 V to VDD + 0.3 V Digital Output Voltage to GND . . . . . –0.3 V to VDD + 0.3 V Reference Input Voltage to GND . . . . –0.3 V to VDD + 0.3 V VOUTA, VOUTB to GND . . . . . . . . . . . –0.3 V to VDD + 0.3 V Operating Temperature Range Industrial (B Version) . . . . . . . . . . . . . . . –40 °C to +105°C Storage Temperature Range . . . . . . . . . . . . –65 °C to +150°C Junction Temperature (TJ Max) . . . . . . . . . . . . . . . . . +150 °C 16-Lead TSSOP Package Power Dissipation . . . . . . . . . . . . . . . . . . (TJ Max – TA)/ θJA θ JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . 160 °C/W Lead Temperature, Soldering Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215 °C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220 °C NOTES 1Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2Transient currents of up to 100 mA will not cause SCR latch-up. PIN CONFIGURATION TOP VIEW (Not to Scale) 16 15 14 13 12 11 10 9 1 2 3 4 5 6 7 8 CLR LDAC VDD VREFB VREFA VOUTA BUF A BUF B SDO GND DIN SCLK SYNC VOUTB PD DCEN AD5303/ AD5313/ AD5323 ORDERING GUIDE Model Temperature Range Package Description Package Option AD5303BRU –40 °C to +105°C Thin Shrink Small Outline Package (TSSOP) RU-16 AD5313BRU –40 °C to +105°C Thin Shrink Small Outline Package (TSSOP) RU-16 AD5323BRU –40 °C to +105°C Thin Shrink Small Outline Package (TSSOP) RU-16 |
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