AD8108/AD8109

–5–

REV. 0

WARNING!

ESD SENSITIVE DEVICE

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection.

Although the AD8108/AD8109 features proprietary ESD protection circuitry, permanent dam-

age may occur on devices subjected to high energy electrostatic discharges. Therefore, proper

ESD precautions are recommended to avoid performance degradation or loss of functionality.

ABSOLUTE MAXIMUM RATINGS

1

Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12.0 V

AD8108/AD8109 80-Lead Plastic TQFP (ST) . . . . . 2.6 W

Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

±V

S

Output Short Circuit Duration

. . . . . . . . . . . . . . . . . . . . . . Observe Power Derating Curves

Storage Temperature Range . . . . . . . . . . . . –65

°C to +125°C

Lead Temperature Range (Soldering 10 sec) . . . . . . . . +300

°C

NOTES

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.

80-lead plastic TQFP (ST):

θ

ORDERING GUIDE

Temperature

Package

Package

Model

Range

Description

Option

AD8108AST

–40

°C to +85°C

80-Lead Plastic TQFP (12 mm

× 12 mm)

ST-80A

AD8109AST

–40

°C to +85°C

80-Lead Plastic TQFP (12 mm

× 12 mm)

ST-80A

AD8108-EB

Evaluation Board

AD8109-EB

Evaluation Board

MAXIMUM POWER DISSIPATION

The maximum power that can be safely dissipated by the

AD8108/AD8109 is limited by the associated rise in junction

temperature. The maximum safe junction temperature for plas-

tic encapsulated devices is determined by the glass transition

temperature of the plastic, approximately +150

°C. Temporarily

exceeding this limit may cause a shift in parametric performance

due to a change in the stresses exerted on the die by the pack-

age. Exceeding a junction temperature of +175

°C for an ex-

tended period can result in device failure.

While the AD8108/AD8109 is internally short circuit protected,

this may not be sufficient to guarantee that the maximum junc-

tion temperature (+150

°C) is not exceeded under all conditions.

To ensure proper operation, it is necessary to observe the maxi-

mum power derating curves shown in Figure 3.

AMBIENT TEMPERATURE – C

5.0

4.0

0

–50

80

–40 –30 –20 –10

0

10

20

30 40

50

60 70

3.0

2.0

1.0

90

Figure 3. Maximum Power Dissipation vs. Temperature