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AD826 데이터시트(PDF) 3 Page - Analog Devices |
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AD826 데이터시트(HTML) 3 Page - Analog Devices |
3 / 14 page REV. B –3– AD826 ABSOLUTE MAXIMUM RATINGS 1 Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±18 V Internal Power Dissipation 2 Plastic (N) . . . . . . . . . . . . . . . . . . . . . See Derating Curves Small Outline (R) . . . . . . . . . . . . . . . . See Derating Curves Input Voltage (Common Mode) . . . . . . . . . . . . . . . . . . . ±VS Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . ±6 V Output Short Circuit Duration . . . . . . . See Derating Curves Storage Temperature Range (N, R) . . . . . . . –65 °C to +125°C Operating Temperature Range . . . . . . . . . . –40 °C to +85°C Lead Temperature Range (Soldering 10 seconds) . . . +300 °C NOTES 1Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability . 2Specification is for device in free air: 8-lead plastic package, θ JA = 100 °C/watt; 8-lead SOIC package, θ JA = 155 °C/watt. ORDERING GUIDE Temperature Package Package Model Range Description Option AD826AN –40 °C to +85°C 8-Lead Plastic DIP N-8 AD826AR –40 °C to +85°C 8-Lead Plastic SOIC SO-8 AD826AR-REEL7 –40 °C to +85°C 7” Tape & Reel SOIC SO-8 AD826AR-REEL –40 °C to +85°C 13” Tape & Reel SOIC SO-8 Parameter Conditions VS Min Typ Max Unit OUTPUT CHARACTERISTICS Output Voltage Swing RLOAD = 500 Ω±5 V 3.3 3.8 ±V RLOAD = 150 Ω±5 V 3.2 3.6 ±V RLOAD = 1 k Ω±15 V 13.3 13.7 ±V RLOAD = 500 Ω±15 V 12.8 13.4 ±V RLOAD = 500 Ω 0, +5 V +1.5, +3.5 V Output Current ±15 V 50 mA ±5 V 50 mA 0, +5 V 30 mA Short-Circuit Current ±15 V 90 mA Output Resistance Open Loop 8 Ω MATCHING CHARACTERISTICS Dynamic Crosstalk f = 5 MHz ±15 V –80 dB Gain Flatness Match G = +1, f = 40 MHz ±15 V 0.2 dB Slew Rate Match G = –1 ±15 V 10 V/ µs DC Input Offset Voltage Match TMIN–TMAX ±5 V to ±15 V 0.5 2 mV Input Bias Current Match TMIN–TMAX ±5 V to ±15 V 0.06 0.8 µA Open-Loop Gain Match VO = ±10 V, RLOAD = 1 kΩ, TMIN–TMAX ±15 V 0.15 0.01 mV/V Common-Mode Rejection Ratio Match VCM = ±12 V, TMIN–TMAX ±15 V 80 100 dB Power Supply Rejection Ratio Match ±5 V to ±15 V, T MIN –TMAX 80 100 dB POWER SUPPLY Operating Range Dual Supply ±2.5 ±18 V Single Supply +5 +36 V Quiescent Current/Amplifier ±5 V 6.6 7.5 mA TMIN to TMAX ±5 V 7.5 mA ±15 V 7.5 mA TMIN to TMAX ±15 V 6.8 7.5 mA Power Supply Rejection Ratio VS = ±5 V to ±15 V, TMIN to TMAX 75 86 dB NOTES 1Full power bandwidth = slew rate/2 π V PEAK. Specifications subject to change without notice. ESD SUSCEPTIBILITY ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 volts, which readily accumulate on the human body and on test equipment, can discharge without detection. Although the AD826 features proprietary ESD protection cir- cuitry, permanent damage may still occur on these devices if they are subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid any performance degradation or loss of functionality. 2.0 0 –50 90 1.5 0.5 –30 1.0 50 70 30 10 –10 80 –40 40 60 20 0 –20 AMBIENT TEMPERATURE – C 8-LEAD MINI-DIP PACKAGE 8-LEAD SOIC PACKAGE TJ = +150 C Maximum Power Dissipation vs. Temperature for Different Package Types |
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