전자부품 데이터시트 검색엔진 |
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AD8565 데이터시트(PDF) 3 Page - Analog Devices |
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AD8565 데이터시트(HTML) 3 Page - Analog Devices |
3 / 12 page AD8565/AD8566/AD8567 –3– REV. A ABSOLUTE MAXIMUM RATINGS* Supply Voltage (VS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 V Input Voltage . . . . . . . . . . . . . . . . . . . . . –0.5 V to VS + 0.5 V Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . VS Storage Temperature Range . . . . . . . . . . . . –65 °C to +150°C Operating Temperature Range . . . . . . . . . . . –40 °C to +85°C Junction Temperature Range . . . . . . . . . . . . –65 °C to +150°C Lead Temperature Range (Soldering, 60 sec) . . . . . . . . 300 °C *Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD8565/AD8566/AD8567 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. WARNING! ESD SENSITIVE DEVICE ORDERING GUIDE Temperature Package Branding Model* Range Package Description Option Information AD8565AKS –40 °C to +85°C 5-Lead Plastic Surface-Mount KS-5 ASA AD8566ARM –40 °C to +85°C 8-Lead MINI_SOIC RM-8 ATA AD8567ARU –40 °C to +85°C 14-Lead Thin Shrink SO RU-14 AD8567ACP –40 °C to +85°C 16-Terminal Leadless Frame Chip Scale CP-16 *Available in reels only. Package Type JA 1 JC Unit 5-Lead SC70 (KS) 376 126 °C/W 8-Lead MSOP (RM) 210 45 °C/W 14-Lead TSSOP (RU) 180 35 °C/W 16-Lead LFCSP (CP) 38 2 30 2 °C/W NOTES 1 θ JA is specified for worst-case conditions, i.e., θ JA is specified for device soldered onto a circuit board for surface mount packages. 2DAP is soldered down to PCB. |
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