REV. A

–4–

ADG419

ABSOLUTE MAXIMUM RATINGS

1

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +44 V

Analog, Digital Inputs

2

or 30 mA, Whichever Occurs First

Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 30 mA

Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA

(Pulsed at 1 ms, 10% Duty Cycle Max)

Operating Temperature Range

Industrial (B Version) . . . . . . . . . . . . . . . . . –40

°C to +85°C

Extended (T Version) . . . . . . . . . . . . . . . . –55

°C to +125°C

Storage Temperature Range . . . . . . . . . . . . . –65

°C to +150°C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150

°C

Cerdip Package, Power Dissipation . . . . . . . . . . . . . . . 600 mW

θ

. . . . . . . . . . . . . . . . . . . . 110

°C/W

Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +300

°C

Plastic Package, Power Dissipation . . . . . . . . . . . . . . . 400 mW

θ

. . . . . . . . . . . . . . . . . . . . 100

°C/W

Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260

°C

SOIC Package, Power Dissipation . . . . . . . . . . . . . . . . 400 mW

θ

. . . . . . . . . . . . . . . . . . . . 155

°C/W

µSOIC Package, Power Dissipation . . . . . . . . . . . . . . . 315 mW

θ

. . . . . . . . . . . . . . . . . . . . 205

°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec). . . . . . . . . . . . . . . . . . . . . . . +215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220

°C

NOTES

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those listed in the operational

sections of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability. Only one absolute

maximum rating may be applied at any one time.

limited to the maximum ratings given.

“ON” switch capacitance.

Delay time between the 50% and 90% points

of the digital inputs and the switch “ON”

condition when switching from one address

state to another.

“OFF” time or “ON” time measured be-

tween the 90% points of both switches

when switching from one address state

to the other.

Maximum input voltage for logic “0.”

Minimum input voltage for logic “1.”

Input current of the digital input.

Crosstalk

A measure of unwanted signal which is

coupled through from one channel to

another as a result of parasitic capacitance.

Off Isolation

A measure of unwanted signal coupling

through an “OFF” channel.

Positive supply current.

Negative supply current.

TERMINOLOGY

Most positive power supply potential.

Most negative power supply potential in dual

supplies. In single supply applications, it

may be connected to GND.

Logic power supply (+5 V).

GND

Ground (0 V) reference.

S

Source terminal. May be an input or an

output.

D

Drain terminal. May be an input or an

output.

IN

Logic control input.

Ohmic resistance between D and S.

Source leakage current with the switch

“OFF.”

Drain leakage current with the switch

“OFF.”

Channel leakage current with the switch

“ON.”

Analog voltage on terminals D, S.

“OFF” switch source capacitance.

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection.

Although the ADG419 features proprietary ESD protection circuitry, permanent damage may

occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD

precautions are recommended to avoid performance degradation or loss of functionality.

WARNING!

ESD SENSITIVE DEVICE