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ADM3485EAR 데이터시트(PDF) 4 Page - Analog Devices |
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ADM3485EAR 데이터시트(HTML) 4 Page - Analog Devices |
4 / 11 page ADM3485E –4– REV. A ORDERING GUIDE Model Temperature Range Package Description Package Options ADM3485EAN –40 °C to +85°C Plastic DIP N-8 ADM3485EAR –40 °C to +85°C Small Outline (SOIC) SO-8 ABSOLUTE MAXIMUM RATINGS* (TA = +25 °C unless otherwise noted) VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7 V Inputs Driver Input (DI) . . . . . . . . . . . . . . . . –0.3 V to VCC + 0.3 V Control Inputs (DE, RE) . . . . . . . . . . –0.3 V to V CC + 0.3 V Receiver Inputs (A, B) . . . . . . . . . . . . . . . –7.5 V to +12.5 V Outputs Driver Outputs . . . . . . . . . . . . . . . . . . . . . –7.5 V to +12.5 V Receiver Output . . . . . . . . . . . . . . . . . –0.5 V to VCC + 0.5 V Power Dissipation 8-Lead DIP . . . . . . . . . . . . . . . . . 800 mW θJA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 140°C/W Power Dissipation 8-Lead SOIC . . . . . . . . . . . . . . . . 650 mW θ JA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 115 °C/W Operating Temperature Range Industrial (A Version) . . . . . . . . . . . . . . . . –40 °C to +85°C Storage Temperature Range . . . . . . . . . . . . –65 °C to +150°C Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . . +300 °C Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . +215 °C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . +220 °C ESD Rating: Air (Human Body Model, All Pins) . . . . . >4 kV ESD Rating: IEC1000-4-2 Contact (A, B Pins) . . . . . . >8 kV EFT Rating: IEC1000-4-4 (A, B Pins) . . . . . . . . . . . . . >2 kV *Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum ratings for extended periods of time may affect device reliability. PIN CONFIGURATION DIP/SOIC TOP VIEW (Not to Scale) 8 7 6 5 1 2 3 4 RO RE DE DI VCC B A GND ADM3485E PIN FUNCTION DESCRIPTIONS Mnemonic DIP/ Pin SOIC Function RO 1 Receiver Output. High when A > B by 200 mV or low when A < B by 200 mV. RE 2 Receiver Output Enable. With RE low, the receiver output RO is enabled. With RE high, the output goes high impedance. If RE is high and DE low, the ADM3485E enters a shutdown state. DE 3 Driver Output Enable. A high level enables the driver differential outputs, A and B. A low level places it in a high impedance state. DI 4 Driver Input. When the driver is enabled, a logic low on DI forces A low and B high, while a logic high on DI forces A high and B low. GND 5 Ground Connection, 0 V. A 6 Noninverting Receiver Input A/Driver Output A. B 7 Inverting Receiver Input B/Driver Output B. VCC 8 Power Supply, 3.3 V ± 0.3 V. |
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