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TMP04GBC 데이터시트(PDF) 3 Page - Analog Devices |
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TMP04GBC 데이터시트(HTML) 3 Page - Analog Devices |
3 / 16 page TMP03/TMP04 REV. 0 –3– WAFER TEST LIMITS Parameter Symbol Conditions Min Typ Max Units ACCURACY Temperature Error TA = +25°C 1 3.0 °C Power Supply Rejection Ratio PSRR Over Rated Supply 1.2 °C/V OUTPUTS Output High Voltage, TMP04 VOH IOH = 800 µA V+ – 0.4 V Output Low Voltage, TMP04 VOL IOL = 800 µA 0.4 V Output Low Voltage, TMP03 VOL ISINK = 1.6 mA 0.2 V POWER SUPPLY Supply Range V+ 4.5 7 V Supply Current ISY Unloaded 1.3 mA NOTES Electrical tests are performed at wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed for standard product dice. Consult factory to negotiate specifications based on dice lot qualification through sample lot assembly and testing. 1Maximum deviation from ratiometric output transfer function over specified temperature range. (V+ = +5 V, GND = 0 V, TA = +25 C, unless otherwise noted) WARNING! ESD SENSITIVE DEVICE CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the TMP03/TMP04 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. ABSOLUTE MAXIMUM RATINGS* Maximum Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . +9 V Maximum Output Current (TMP03 DOUT) . . . . . . . . . 50 mA Maximum Output Current (TMP04 DOUT) . . . . . . . . . 10 mA Maximum Open-Collector Output Voltage (TMP03) . . +18 V Operating Temperature Range . . . . . . . . . . . –55 °C to +150°C Dice Junction Temperature . . . . . . . . . . . . . . . . . . . . +175 °C Storage Temperature Range . . . . . . . . . . . . –65 °C to +160°C Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . +300 °C *CAUTION 1Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation at or above this specification is not implied. Exposure to the above maximum rating conditions for extended periods may affect device reliability. 2Digital inputs and outputs are protected, however, permanent damage may occur on unprotected units from high-energy electrostatic fields. Keep units in conduc- tive foam or packaging at all times until ready to use. Use proper antistatic handling procedures. 3Remove power before inserting or removing units from their sockets. Package Type Θ JA Θ JC Units TO-92 (T9) 162 1 120 °C/W SO-8 (S) 158 1 43 °C/W TSSOP (RU) 240 1 43 °C/W NOTE 1 Θ JA is specified for device in socket (worst case conditions). DICE CHARACTERISTICS Die Size 0.050 × 0.060 inch, 3,000 sq. mils ( 1.27 × 1.52 mm, 1.93 sq. mm) For additional DICE ordering information, refer to databook. ORDERING GUIDE Accuracy Temperature Model at +25 C Range Package TMP03FT9 ±3.0 XIND TO-92 TMP03FS ±3.0 XIND SO-8 TMP03FRU ±3.0 XIND TSSOP-8 TMP03GBC ±3.0 +25 °C Die TMP04FT9 ±3.0 XIND TO-92 TMP04FS ±3.0 XIND SO-8 TMP04FRU ±3.0 XIND TSSOP-8 TMP04GBC ±3.0 +25 °C Die |
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