© 2005 Fairchild Semiconductor Corporation

DS012001

www.fairchildsemi.com

February 1994

Revised May 2005

74LCX16245

Low Voltage 16-Bit Bidirectional Transceiver

with 5V Tolerant Inputs and Outputs

General Description

The LCX16245 contains sixteen non-inverting bidirectional

buffers with 3-STATE outputs and is intended for bus ori-

ented applications. The device is designed for low voltage

ing to a 5V signal environment. The device is byte con-

trolled. Each byte has separate control inputs which could

be shorted together for full 16-bit operation. The T/R inputs

determine the direction of data flow through the device.

The OE inputs disable both the A and B ports by placing

them in a high impedance state.

The LCX16245 is fabricated with an advanced CMOS tech-

nology to achieve high speed operation while maintaining

CMOS low power dissipation.

Features

s 5V tolerant inputs and outputs

s Power down high impedance inputs and outputs

s Supports live insertion/withdrawal (Note 1)

s

s Uses patented noise/EMI reduction circuitry

s Latch-up performance exceeds 500 mA

s ESD performance:

Human body model

! 2000V

Machine model

! 200V

s Also packaged in plastic Fine-Pitch Ball Grid Array

(FBGA)

Note 1: To ensure the high-impedance state during power up or down, OE

resistor is determined by the current-sourcing capability of the driver.

Ordering Code:

Note 2: Ordering code “G” indicates Trays.

Note 3: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.

Logic Symbol

Order Number

Package Number

Package Description

74LCX16245G

(Note 2)(Note 3)

BGA54A

54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide

74LCX16245MEA

(Note 3)

MS48A

48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide

74LCX16245MTD

(Note 3)

MTD48

48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide