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RECOMMENDED OPERATING CONDITIONS

THERMAL RESISTANCE

UC1854A

UC2854A, UC2854B

UC3854A, UC3854B

SLUS329E – MONTH 2003 – REVISED JANUARY 2008

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage

10

20

V

UC1854X

–55

125

Operating junction temperature

UC2854X

–40

85

°C

UC3854X

0

70

PACKAGED DEVICES

RESISTANCES

CDIP-16

PDIP-16

SOP-16

PLCC-20

(J)

(N)

(DW)

(Q)

θ

45

27

34

θ

80–120

(1)

θ

60 mil microcircuit device silicon die and applicable for devices with die sizes up to 14,400 square mils. For device die sizes greater than

14,400 square mils use the following values, dual-in-line, 11

°C/W; flat pack and pin grid array, 10°C/W.are at the end of each trace.

(2)

θ

resitance range is given, lower values are for five square inch aluminum PC board. Test PWB is 0.062 inches thick and typically uses

0,635 mm trace widths for power packages and 1,3 mm trace widths for non-power packages with a 100

× 100 mil probe land are at the

end of each trace.

Copyright © 2003–2008, Texas Instruments Incorporated

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Product Folder Link(s): UC1854A UC2854A, UC2854B UC3854A, UC3854B