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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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AD7730LBR 데이터시트(PDF) 5 Page - Analog Devices |
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AD7730LBR 데이터시트(HTML) 5 Page - Analog Devices |
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5 / 53 page  AD7730/AD7730L –5– CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD7730 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. ABSOLUTE MAXIMUM RATINGS* (TA = +25 °C unless otherwise noted) AVDD to AGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V AVDD to DGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V DVDD to AGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V DVDD to DGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V AGND to DGND . . . . . . . . . . . . . . . . . . . . . . –5 V to +0.3 V AVDD to DVDD . . . . . . . . . . . . . . . . . . . . . . . . . –2 V to +5 V Analog Input Voltage to AGND . . . . –0.3 V to AVDD + 0.3 V Reference Input Voltage to AGND . . –0.3 V to AVDD + 0.3 V AIN/REF IN Current (Indefinite) . . . . . . . . . . . . . . . . 30 mA Digital Input Voltage to DGND . . . . –0.3 V to DVDD + 0.3 V Digital Output Voltage to DGND . . . –0.3 V to DVDD + 0.3 V Output Voltage (ACX, ACX, D0, D1) to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to AVDD + 0.3 V Operating Temperature Range Industrial (B Version) . . . . . . . . . . . . . . . –40 °C to +85°C Storage Temperature Range . . . . . . . . . . . –65 °C to +150°C Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . +150 °C Plastic DIP Package, Power Dissipation . . . . . . . 450 mW θJA Thermal Impedance . . . . . . . . . . . . . . . . . 105°C/W Lead Temperature (Soldering, 10 sec) . . . . . . . +260 °C TSSOP Package, Power Dissipation . . . . . . . . . . 450 mW θJA Thermal Impedance . . . . . . . . . . . . . . . . . 128°C/W Lead Temperature, Soldering Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . +215 °C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . +220 °C SOIC Package, Power Dissipation . . . . . . . . . . . . 450 mW θJA Thermal Impedance . . . . . . . . . . . . . . . . . . 75°C/W Lead Temperature, Soldering Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . +215 °C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . +220 °C *Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. TO OUTPUT PIN 50pF ISINK (800 A AT DVDD = +5V 100 A AT DVDD = +3V) +1.6V ISOURCE (200 A AT DVDD = +5V 100 A AT DVDD = +3V) Figure 1. Load Circuit for Access Time and Bus Relinquish Time WARNING! ESD SENSITIVE DEVICE REV. B |
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