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E-TDA7479AD 데이터시트(PDF) 9 Page - STMicroelectronics |
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E-TDA7479AD 데이터시트(HTML) 9 Page - STMicroelectronics |
9 / 12 page TDA7479 Package information 9/12 5 Package information In order to meet environmental requirements, ST (also) offers these devices in ECOPACK® packages. ECOPACK® packages are lead-free. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 4. SO16 mechanical data and package dimensions OUTLINE AND MECHANICAL DATA DIM. mm inch MIN. TYP. MAX. MIN. TYP. MAX. A 2.35 2.65 0.093 0.104 A1 0.10 0.30 0.004 0.012 B 0.33 0.51 0.013 0.200 C 0.23 0.32 0.009 0.013 D (1) 10.10 10.50 0.398 0.413 E 7.40 7.60 0.291 0.299 e 1.27 0.050 H 10.0 10.65 0.394 0.419 h 0.25 0.75 0.010 0.030 L 0.40 1.27 0.016 0.050 k 0˚ (min.), 8˚ (max.) ddd 0.10 0.004 (1) “D” dimension does not include mold flash, protusions or gate burrs. Mold flash, protusions or gate burrs shall not exceed 0.15mm per side. SO16 (Wide) 0016021 C |
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