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AD8002AR 데이터시트(PDF) 3 Page - Analog Devices |
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AD8002AR 데이터시트(HTML) 3 Page - Analog Devices |
3 / 20 page REV. D AD8002 –3– ABSOLUTE MAXIMUM RATINGS 1 Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13.2 V Internal Power Dissipation 2 Plastic DIP Package (N) . . . . . . . . . . . . . . . . . . . . . . . 1.3 W Small Outline Package (R) . . . . . . . . . . . . . . . . . . . . . . 0.9 W µSOIC Package (RM) . . . . . . . . . . . . . . . . . . . . . . . . . 0.6 W Input Voltage (Common Mode) . . . . . . . . . . . . . . . . . . . . ±VS Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . ±1.2 V Output Short Circuit Duration . . . . . . . . . . . . . . . . . . . . . . Observe Power Derating Curves Storage Temperature Range N, R, RM . . . . . –65 °C to +125°C Operating Temperature Range (A Grade) . . . – 40 °C to +85°C Lead Temperature Range (Soldering 10 sec) . . . . . . . . . 300 °C NOTES 1Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2Specification is for device in free air: 8-Lead Plastic DIP Package: θ JA = 90 °C/W 8-Lead SOIC Package: θ JA = 155 °C/W 8-Lead µSOIC Package: θ JA = 200 °C/W MAXIMUM POWER DISSIPATION The maximum power that can be safely dissipated by the AD8002 is limited by the associated rise in junction tempera- ture. The maximum safe junction temperature for plastic encapsulated devices is determined by the glass transition tem- perature of the plastic, approximately 150 °C. Exceeding this limit temporarily may cause a shift in parametric performance due to a change in the stresses exerted on the die by the package. Exceeding a junction temperature of 175 °C for an extended period can result in device failure. While the AD8002 is internally short circuit protected, this may not be sufficient to guarantee that the maximum junction temperature (150 °C) is not exceeded under all conditions. To ensure proper operation, it is necessary to observe the maximum power derating curves. 2.0 0 –50 80 1.5 0.5 –40 1.0 010 –10 –20 –30 20 30 40 50 60 70 90 AMBIENT TEMPERATURE – C 8-LEAD PLASTIC-DIP PACKAGE 8-LEAD SOIC PACKAGE TJ = 150 C 8-LEAD SOIC PACKAGE Figure 3. Plot of Maximum Power Dissipation vs. Temperature CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD8002 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. ORDERING GUIDE Model Temperature Range Package Description Package Option Brand Code AD8002AN –40 °C to +85°C 8-Lead PDIP N-8 Standard AD8002AR –40 °C to +85°C 8-Lead SOIC SO-8 Standard AD8002AR-REEL –40 °C to +85°C 8-Lead SOIC 13" REEL SO-8 Standard AD8002AR-REEL7 –40 °C to +85°C 8-Lead SOIC 7" REEL SO-8 Standard AD8002ARM –40 °C to +85°C 8-Lead µSOIC RM-8 HFA AD8002ARM-REEL –40 °C to +85°C 8-Lead µSOIC 13" REEL RM-8 HFA AD8002ARM-REEL7 –40 °C to +85°C 8-Lead µSOIC 7" REEL RM-8 HFA WARNING! ESD SENSITIVE DEVICE |
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