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HLMP-3750-L0N02 데이터시트(PDF) 11 Page - AVAGO TECHNOLOGIES LIMITED |
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HLMP-3750-L0N02 데이터시트(HTML) 11 Page - AVAGO TECHNOLOGIES LIMITED |
11 / 12 page 11 Example of Wave Soldering Temperature Profile for TH LED 0 10 20 30 40 50 60 70 80 90 100 250 200 150 100 50 TIME (MINUTES) PREHEAT TURBULENT WAVE LAMINAR HOT AIR KNIFE Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) Flux: Rosin flux Solder bath temperature: 245°C± 5°C (maximum peak temperature = 250°C) Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec) Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) Flux: Rosin flux Solder bath temperature: 245°C± 5°C (maximum peak temperature = 250°C) Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec) Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. Packaging Label: (i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box) (1P) Item: Part Number (1T) Lot: Lot Number LPN: (9D)MFG Date: Manufacturing Date (P) Customer Item: (V) Vendor ID: DeptID: Made In: Country of Origin (Q) QTY: Quantity CAT: Intensity Bin BIN: Color Bin (9D) Date Code: Date Code STANDARD LABEL LS0002 RoHS Compliant e3 max temp 250C |
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유사한 설명 - HLMP-3750-L0N02 |
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