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SMA6F5.0A 데이터시트(PDF) 7 Page - STMicroelectronics |
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SMA6F5.0A 데이터시트(HTML) 7 Page - STMicroelectronics |
7 / 9 page SMA6F Package information Doc ID 14996 Rev 2 7/9 3 Package information ● Case: JEDEC DO-221AC molded plastic over Planar junction ● Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 ● Polarity: Band indicates cathode ● Flammability: Epoxy rated UL94V-0 ● RoHS package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 5. SMAflat (non exposed pad) dimensions Ref. Dimensions Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.90 1.10 0.035 0.043 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.006 0.016 D 2.25 2.95 0.088 0.116 E 4.80 5.60 0.189 0.220 E1 3.95 4.60 0.156 0.181 L 0.75 1.50 0.030 0.059 L1 0.50 0.019 L2 0.50 0.019 Figure 11. SMAflat footprint dimensions Figure 12. Marking information D A L 2x L L2 2x L1 2x E E1 b c 1.20 (0.047) 1.20 (0.047) 3.12 (0.123) 5.52 (0.217) 1.52 (0.060) millimeters (inches) y w w z x x x ECOPACK status XXX: Marking Z: Manufacturing location Y: Year WW: week Cathode bar (unidirectional devices only ) |
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