전자부품 데이터시트 검색엔진 |
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LF80539JF0282M 데이터시트(PDF) 2 Page - Intel Corporation |
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LF80539JF0282M 데이터시트(HTML) 2 Page - Intel Corporation |
2 / 4 page • Intel® E7520 chipset, featuring high bandwidth for increased memory and I/O throughput with dual-processor support, provid- ing four high-performance cores per platform (see Figure 1). • Intel® 3100 chipset, providing a single chip system controller. This integrated chipset combines the Memory Controller Hub (MCH) and I/O Controller Hub (ICH) into a single component, significantly conserving board real-estate and power consumption. • Two complete execution cores in one processor package provide advancements in simultaneous computing such as multi-threaded applications and multi-tasking environments. Dual-core processing efficiently delivers performance while balancing power requirements. • High-performance front-side bus (FSB) provides dual-processor support for demanding high-performance, volume applications. Combined with dual-core processing, this supports up to four simultaneous threads on the system. • Enhanced Intel SpeedStep® technology allows a system to dynamically adjust processor voltage and core frequency, decreasing average power consumption and average heat production. • Intel® Smart Cache Design allows two execution cores to share 2 MB of L2 cache, reducing FSB traffic and enhancing system responsiveness. • Intel® Advanced Thermal Manager supports new digital temperature sensors and thermal monitors on each execution core to enhance thermal monitoring accuracy. • Streaming SIMD Extensions 3 (SSE3) provides significant performance enhancement for multi-media applications. Additional instructions designed to improve thread synch- ronization, complex arithmetic, graphics, and video encoding. • Fully code compatible with existing Intel® architecture-based 32-bit application software. • Utilizing Intel® Dynamic Power Coordination, application software or operating system can change the sleep state of each execution core, allowing the platform to balance performance and power dissipation. • FSB address, data, and response parity protection provides a key reliability and data integrity feature for the communica- tions, storage, and other embedded market segments. • Enhanced 36-bit memory addressing supports up to 16 GB of DDR2 memory, when paired with the Intel E7520 chipset. • Embedded lifecycle support protects system investment by enabling extended product availability. • Along with a strong ecosystem of hardware and software vendors, including members of the Intel® Communications Alliance (intel.com/go/ica), Intel helps developers cost-effectively meet design challenges and shorten time-to-market. Product Highlights (continued) |
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