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AD7740YRT 데이터시트(PDF) 3 Page - Analog Devices |
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AD7740YRT 데이터시트(HTML) 3 Page - Analog Devices |
3 / 11 page AD7740 REV. A –3– (VDD = 3.0 V to 3.6 V, 4.75 V to 5.25 V, GND = O V, REFIN = 2.5 V) Limit at TMIN, TMAX Limit at TMIN, TMAX Parameter VDD = 3.0 V to 3.6 V VDD = 4.75 V to 5.25 V Unit Conditions/Comments fCLKIN 32 32 kHz min Clock Frequency 1 1 MHz max tHIGH:tLOW 40:60 40:60 min Clock Mark/Space Ratio 60:40 60:40 max t1 50 35 ns typ CLKIN Edge to FOUT Edge Delay t2 2.3 1.8 ns typ FOUT Rise Time t3 1.6 1.4 ns typ FOUT Fall Time t4 tHIGH ±20 tHIGH ±8 ns typ FOUT Pulsewidth NOTES 1Guaranteed by design and characterization, not production tested. 2All input signals are specified with tr = tf = 5 ns (10% to 90% of VDD) and timed from a voltage level of (V IL + VIH)/2. 3See Figure 1. Specifications subject to change without notice. t3 t2 t1 t4 tHIGH tLOW CLKIN FOUT Figure 1. Timing Diagram TIMING CHARACTERISTICS1, 2, 3 ABSOLUTE MAXIMUM RATINGS * (TA = 25 °C unless otherwise noted) VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V Analog Input Voltage to GND . . . . . . . . –0.3 V to VDD + 0.3 V Reference Input Voltage to GND . . . . . –0.3 V to VDD + 0.3 V Logic Input Voltage to GND . . . . . . . . –0.3 V to VDD + 0.3 V FOUT Voltage to GND . . . . . . . . . . . –0.3 V to VDD + 0.3 V Operating Temperature Range Commercial (K Version) . . . . . . . . . . . . . . . . 0 °C to +85°C Automotive (Y Version) . . . . . . . . . . . . . . –40 °C to +105°C Storage Temperature Range . . . . . . . . . . . . –65 °C to +150°C Junction Temperature (TJ Max) . . . . . . . . . . . . . . . . . . 150 °C SOT-23 Package Power Dissipation . . . . . . . . . . . . . . . . . . (TJ Max – TA)/ θ JA θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 240°C/W Lead Temperature (10 secs) . . . . . . . . . . . . . . . . . . 300 °C Reflow Soldering Peak Temperature . . . . . . . . . . . . . . . . . . . . 220 + 5/0 °C Time at Peak Temperature . . . . . . . . . . . . 10 sec to 40 sec microSOIC Package Power Dissipation . . . . . . . . . . . . . . . . . (TJ Max – TA)/ θJA θ JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 206 °C/W θJC Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 44°C/W Lead Temperature (10 secs) . . . . . . . . . . . . . . . . . . . 300 °C Reflow Soldering Peak Temperature . . . . . . . . . . . . . . . . . . . . . . 220 +5/0 °C Time at Peak Temperature . . . . . . . . . . . . . 10 sec to 40 sec *Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD7740 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. WARNING! ESD SENSITIVE DEVICE |
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