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AD7742YR 데이터시트(PDF) 4 Page - Analog Devices |
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AD7742YR 데이터시트(HTML) 4 Page - Analog Devices |
4 / 12 page REV. 0 AD7741/AD7742 –4– CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD7741/AD7742 features proprietary ESD protection circuitry, permanent dam- age may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. WARNING! ESD SENSITIVE DEVICE TIMING CHARACTERISTICS 1, 2, 3 Limit at TMIN, TMAX Parameter (B and Y Version) Units Conditions/Comments fCLKIN 6.144 MHz max tHIGH/tLOW 55/45 max Input Clock Mark/Space Ratio 45/55 min t1 9 ns typ fCLOCK Rising Edge to fOUT Rising Edge t2 4 ns typ fOUT Rise Time t3 4 ns typ fOUT Fall Time t4 tHIGH ± 5 ns typ fOUT Pulsewidth NOTES 1Guaranteed by design and characterization, not production tested. 2All input signals are specified with tr = tf = 5 ns (10% to 90% of V DD) and timed from a voltage level of (V IL + VIH)/2. 3See Figure 1. Specifications subject to change without notice. (VDD = +4.75 V to +5.25 V; VREF = +2.5 V. All specifications TMIN to TMAX unless otherwise noted.) ABSOLUTE MAXIMUM RATINGS 1, 2 (TA = +25°C unless otherwise noted) VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V Analog Input Voltage to GND . . . . . . . . –5 V to VDD + 0.3 V Digital Input Voltage to GND . . . . . . . –0.3 V to VDD + 0.3 V Reference Input Voltage to GND . . . . –0.3 V to VDD + 0.3 V fOUT to GND . . . . . . . . . . . . . . . . . . . . –0.3 V to VDD + 0.3 V Operating Temperature Range Automotive (Y Version) . . . . . . . . . . . . . . –40 °C to +105°C Industrial (B Version) . . . . . . . . . . . . . . . . –40 °C to +85°C Storage Temperature Range . . . . . . . . . . . . –65 °C to +150°C Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . +150 °C Plastic DIP Package Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . 450 mW θ JA Thermal Impedance (8 Lead) . . . . . . . . . . . . . 125 °C/W θ JA Thermal Impedance (16 Lead) . . . . . . . . . . . . 117 °C/W Lead Temperature, Soldering Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . +215 °C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . +220 °C SOIC Package Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . 450 mW θ JA Thermal Impedance (8 Lead) . . . . . . . . . . . . . 157 °C/W θ JA Thermal Impedance (16 Lead) . . . . . . . . . . . . 125 °C/W Lead Temperature, Soldering Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . +215 °C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . +220 °C NOTES 1Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2Transient currents of up to 100 mA will not cause SCR latch-up. ORDERING GUIDE Temperature Package Package Models Ranges Descriptions Options AD7741BN –40 °C to +85°C Plastic DIP N-8 AD7741BR –40 °C to +85°C Small Outline R-8 AD7741YR –40 °C to +105°C Small Outline R-8 AD7742BN –40 °C to +85°C Plastic DIP N-16 AD7742BR –40 °C to +85°C Small Outline R-16A AD7742YR –40 °C to +105°C Small Outline R-16A CLKIN fOUT tHIGH t4 t1 t2 t3 Figure 1. Timing Diagram |
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