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AD8170ARZ 데이터시트(PDF) 4 Page - Analog Devices |
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AD8170ARZ 데이터시트(HTML) 4 Page - Analog Devices |
4 / 16 page AD8170/AD8174 –4– REV. 0 WARNING! ESD SENSITIVE DEVICE CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD8170/AD8174 feature proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. ABSOLUTE MAXIMUM RATINGS 1 Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.6 V Internal Power Dissipation 2 AD8170 8-Lead Plastic (N) . . . . . . . . . . . . . . . . . 1.3 Watts AD8170 8-Lead Small Outline (R) . . . . . . . . . . . 0.9 Watts AD8174 14-Lead Plastic (N) . . . . . . . . . . . . . . . . 1.6 Watts AD8174 14-Lead Small Outline (R) . . . . . . . . . . 1.0 Watts Input Voltage (Common Mode) . . . . . . . . . . . . . . . . . . . . ±V S Output Short Circuit Duration . . Observe Power Derating Curves Storage Temperature Range N & R Packages . . . . . . . . . . . . . . . . . . . . –65 °C to +125°C Lead Temperature Range (Soldering 10 sec) . . . . . . . . +300 °C NOTES 1Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2Specification is for device in free air: 8-Pin Plastic Package: θ JA = 90°C/Watt; 8-Pin SOIC Package: θ JA = 160°C/Watt; 14-Pin Plastic Package: θJA = 90°C/Watt 14-Pin SOIC Package: θ JA = 120°C/Watt, where PD = (TJ–TA)/θJA. ORDERING GUIDE Temperature Package Package Model Range Description Option AD8170AN –40 °C to +85°C 8-Pin Plastic DIP N-8 AD8170AR –40 °C to +85°C 8-Pin SOIC SO-8 AD8170AR-REEL –40 °C to +85°C Reel 8-Pin SOIC SO-8 AD8174AN –40 °C to +85°C 14-Pin Plastic DIP N-14 AD8174AR –40 °C to +85°C 14-Pin Narrow SOIC R-14 AD8174AR-REEL –40 °C to +85°C Reel 14-Pin SOIC R-14 AD8170-EB Evaluation Board For AD8170R AD8174-EB Evaluation Board For AD8174R MAXIMUM POWER DISSIPATION The maximum power that can be safely dissipated by the AD8170 and AD8174 is limited by the associated rise in junction temperature. The maximum safe junction temperature for plastic encapsulated devices is determined by the glass transition temperature of the plastic, approximately +150 °C. Exceeding this limit temporarily may cause a shift in parametric performance due to a change in the stresses exerted on the die by the package. Exceeding a junction temperature of +175 °C for an extended period can result in device failure. While the AD8170 and AD8174 are internally short circuit protected, this may not be sufficient to guarantee that the maxi- mum junction temperature (+150 °C) is not exceeded under all conditions. To ensure proper operation, it is necessary to observe the maximum power derating curves shown in Figures 2 and 3. AMBIENT TEMPERATURE – °C 2.0 1.5 0 –50 90 –40 –30 –20 –10 0 10 20 30 50 60 70 80 40 1.0 0.5 8-PIN MINI-DIP PACKAGE 8-PIN SOIC PACKAGE TJ = +150°C Figure 2. AD8170 Maximum Power Dissipation vs. Temperature AMBIENT TEMPERATURE – °C 2.5 2.0 0.5 –50 90 –40 –30 –20 –10 0 10 20 30 40 50 60 80 1.5 1.0 70 14-PIN SOIC 14-PIN DIP PACKAGE TJ = +150°C Figure 3. AD8174 Maximum Power Dissipation vs. Temperature |
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