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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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LM2675N-3.3 데이터시트(PDF) 5 Page - Texas Instruments |
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LM2675N-3.3 데이터시트(HTML) 5 Page - Texas Instruments |
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5 / 30 page  LM2675 www.ti.com SNVS129E – MAY 2004 – REVISED JUNE 2005 All Output Voltage Versions Electrical Characteristics (continued) Specifications with standard type face are for TJ = 25°C, and those with bold type face apply over full Operating Temperature Range. Unless otherwise specified, VIN = 12V for the 3.3V, 5V, and Adjustable versions and VIN = 24V for the 12V version, and ILOAD = 100 mA. Symbol Parameters Conditions Typ Min Max Units IL Output Leakage Current VIN = 40V, ON/OFF Pin = 0V 1 25 μA VSWITCH = 0V VSWITCH = −1V, ON/OFF Pin = 0V 6 15 mA RDS(ON) Switch On-Resistance ISWITCH = 1A 0.25 0.30/0.50 Ω fO Oscillator Frequency Measured at Switch Pin 260 225 275 kHz D Maximum Duty Cycle 95 % Minimum Duty Cycle 0 % IBIAS Feedback Bias VFEEDBACK = 1.3V 85 nA Current ADJ Version Only VS/D ON/OFF Pin 1.4 0.8 2.0 V Voltage Thesholds IS/D ON/OFF Pin Current ON/OFF Pin = 0V 20 7 37 μA θJA Thermal Resistance P Package, Junction to Ambient(1) 95 °C/W D Package, Junction to Ambient(1) 105 (1) Junction to ambient thermal resistance with approximately 1 square inch of printed circuit board copper surrounding the leads. Additional copper area will lower thermal resistance further. See Application Information section in the application note accompanying this datasheet and the thermal model in LM267X Made Simple software (version 6.0). The value θJ−A for the WSON (NHN) package is specifically dependent on PCB trace area, trace material, and the number of layers and thermal vias. For improved thermal resistance and power dissipation for the WSON package, refer to Application Note AN-1187 (SNOA401). Copyright © 2004–2005, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: LM2675 |
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