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AD7862ARS-2 데이터시트(PDF) 3 Page - Analog Devices

부품명 AD7862ARS-2
상세설명  Simultaneous Sampling Dual 250 kSPS 12-Bit ADC
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REV. 0
AD7862
AB
S
Parameter
Version
1
Version
Version
Units
Test Conditions/Comments
LOGIC OUTPUTS
Output High Voltage, VOH
4.0
4.0
4.0
V min
ISOURCE = 200
µA
Output Low Voltage, VOL
0.4
0.4
0.4
V max
ISINK = 1.6 mA
DB11–DB0
Floating-State Leakage Current
±10
±10
±10
µA max
Floating-State Capacitance
4
10
10
10
pF max
Output Coding
AD7862-10, AD7862-3
Twos Complement
AD7863-2
Straight (Natural) Binary
CONVERSION RATE
Conversion Time
3.6
3.6
3.6
µs max
For Both Channels
Track/Hold Acquisition Time
2, 3
0.3
0.3
0.3
µs max
POWER REQUIREMENTS
VDD
+5
+5
+5
V nom
±5% for Specified Performance
IDD
Normal Mode
15
15
15
mA max
Standby Mode
25
25
25
µA max
Logic Inputs = 0 V or VDD
Power Dissipation
Normal Mode
75
75
75
mW max
Typically 60 mW
Standby Mode
125
125
125
µW max
Typically 75
µW
NOTES
1Temperature ranges are as follows: A, B Versions: –40
°C to +85°C;
S Version: –55
°C to +125°C.
2 Performance measured through full channel (multiplexer, SHA and ADC).
3See Terminology.
ABSOLUTE MAXIMUM RATINGS*
(TA = +25°C unless otherwise noted)
VDD to AGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
VDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
AGND to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±0.3 V
Analog Input Voltage to AGND
AD7862-10 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±17 V
AD7862-3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±7V
AD7862-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7 V
Reference Input Voltage to AGND . . . –0.3 V to VDD + 0.3 V
Digital Input Voltage to DGND . . . . . –0.3 V to VDD + 0.3 V
Digital Output Voltage to DGND . . . . –0.3 V to VDD + 0.3 V
Operating Temperature Range
Commercial (A, B Version) . . . . . . . . . . .
–40
°C to +85°C
Extended (S Version) . . . . . . . . . . . . . . . . –55
°C to +125°C
Storage Temperature Range . . . . . . . . . . . . –65
°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . +150
°C
Plastic DIP Package, Power Dissipation . . . . . . . . . . 670 mW
θ
JA Thermal Impedance
. . . . . . . . . . . . . . . . . . . . 116
°C/W
Lead Temperature, (Soldering 10 sec) . . . . . . . . . . +260
°C
Ceramic DIP Package, Power Dissipation . . . . . . . . . 670 mW
θ
JA Thermal Impedance
. . . . . . . . . . . . . . . . . . . . 116
°C/W
Lead Temperature, (Soldering 10 sec) . . . . . . . . . . +260
°C
SOIC Package, Power Dissipation . . . . . . . . . . . . . . . 450 mW
θ
JA Thermal Impedance
. . . . . . . . . . . . . . . . . . . . 110
°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . +215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . +220
°C
SSOP Package, Power Dissipation . . . . . . . . . . . . . . . 450 mW
θ
JA Thermal Impedance
. . . . . . . . . . . . . . . . . . . . 110
°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . +215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . +220
°C
*Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those listed in the
operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
ORDERING GUIDE
Input
Relative
Temperature
Package
Package
Model
Input
Accuracy
Range
Description
Option
AD7862AR-10
±10 V
±1 LSB
–40
°C to +85°C
28-Bit Small Outline Package
R-28
AD7862BR-10
±10 V
±1 LSB
–40
°C to +85°C
28-Bit Small Outline Package
R-28
AD7862ARS-10
±10 V
±1 LSB
–40
°C to +85°C
28-Bit Shrink Small Outline Package
RS-28
AD7862AN-10
±10 V
±1 LSB
–40
°C to +85°C
28-Bit Plastic DIP
N-28
AD7862SQ-10
±10 V
±1 LSB
–55
°C to +125°C
28-Bit Cerdip
Q-28
AD7862AR-3
±2.5 V
±1 LSB
–40
°C to +85°C
28-Bit Small Outline Package
R-28
AD7862BR-3
±2.5 V
±1 LSB
–40
°C to +85°C
28-Bit Small Outline Package
R-28
AD7862ARS-3
±2.5 V
±1 LSB
–40
°C to +85°C
28-Bit Shrink Small Outline Package
RS-28
AD7862AN-3
±2.5 V
±1 LSB
–40
°C to +85°C
28-Plastic DIP
N-28
AD7862AR-2
0 V to 2.5 V
±1 LSB
–40
°C to +85°C
28-Bit Small Outline Package
R-28
AD7862ARS-2
0 V to 2.5 V
±1 LSB
–40
°C to +85°C
28-Bit Shrink Small Outline Package
RS-28
4Sample tested @ +25
°C to ensure compliance.
Specifications subject to change without notice.


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