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AM29LV128MH 데이터시트(Datasheet) 5 Page - Advanced Micro Devices

부품명 AM29LV128MH
상세내용  128 Megabit (8 M x 16-Bit/16 M x 8-Bit) MirrorBit™ 3.0 Volt-only Uniform Sector Flash Memory with VersatileI/O Control
PDF  65 Pages
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제조사  AMD [Advanced Micro Devices]
홈페이지  http://www.amd.com
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 5 page
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September 9, 2003
Am29LV128MH/L
3
DA T A SH EET
TABLE OF CONTENTS
Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 4
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . 5
Pin Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 8
Device Bus Operations . . . . . . . . . . . . . . . . . . . . . 9
Table 1. Device Bus Operations ....................................................... 9
Word/Byte Configuration .......................................................... 9
VersatileIO
™ (V
IO) Control ....................................................... 9
Requirements for Reading Array Data ................................... 10
Page Mode Read ............................................................................10
Writing Commands/Command Sequences ............................ 10
Write Buffer .....................................................................................10
Accelerated Program Operation ......................................................10
Autoselect Functions .......................................................................10
Standby Mode ........................................................................ 10
Automatic Sleep Mode ........................................................... 11
RESET#: Hardware Reset Pin ............................................... 11
Output Disable Mode .............................................................. 11
Table 2. Sector Address Table........................................................ 12
Autoselect Mode ..................................................................... 18
Table 3. Autoselect Codes, (High Voltage Method) ....................... 18
Sector Group Protection and Unprotection ............................. 19
Table 4. Sector Group Protection/Unprotection Address Table ..... 19
Write Protect (WP#) ................................................................ 20
Temporary Sector Group Unprotect ....................................... 20
Figure 1. Temporary Sector Group Unprotect Operation ................20
Figure 2. In-System Sector Group Protect/Unprotect Algorithms ...21
SecSi (Secured Silicon) Sector Flash Memory Region .......... 22
Table 5. SecSi Sector Contents ...................................................... 22
Figure 3. SecSi Sector Protect Verify ..............................................23
Hardware Data Protection ...................................................... 23
Low VCC Write Inhibit .....................................................................23
Write Pulse “Glitch” Protection ........................................................23
Logical Inhibit ..................................................................................23
Power-Up Write Inhibit ....................................................................23
Common Flash Memory Interface (CFI) . . . . . . . 23
Table 6. CFI Query Identification String ..........................................24
Table 7. System Interface String..................................................... 24
Table 8. Device Geometry Definition ..............................................25
Table 9. Primary Vendor-Specific Extended Query ........................26
Command Definitions . . . . . . . . . . . . . . . . . . . . . 27
Reading Array Data ................................................................ 27
Reset Command ..................................................................... 27
Autoselect Command Sequence ............................................ 27
Enter SecSi Sector/Exit SecSi Sector Command Sequence .. 28
Word/Byte Program Command Sequence ............................. 28
Unlock Bypass Command Sequence ..............................................28
Write Buffer Programming ...............................................................28
Accelerated Program ......................................................................29
Figure 4. Write Buffer Programming Operation ...............................30
Figure 5. Program Operation ..........................................................31
Program Suspend/Program Resume Command Sequence ... 31
Figure 6. Program Suspend/Program Resume ...............................32
Chip Erase Command Sequence ........................................... 32
Sector Erase Command Sequence ........................................ 32
Figure 7. Erase Operation ...............................................................33
Erase Suspend/Erase Resume Commands ........................... 33
Command Definitions ............................................................. 34
Table 10. Command Definitions (x16 Mode, BYTE# = V
IH) ........... 34
Table 11. Command Definitions (x8 Mode, BYTE# = V
IL).............. 35
Write Operation Status . . . . . . . . . . . . . . . . . . . . . 36
DQ7: Data# Polling ................................................................. 36
Figure 8. Data# Polling Algorithm .................................................. 36
RY/BY#: Ready/Busy# ............................................................ 37
DQ6: Toggle Bit I .................................................................... 37
Figure 9. Toggle Bit Algorithm ........................................................ 38
DQ2: Toggle Bit II ................................................................... 38
Reading Toggle Bits DQ6/DQ2 ............................................... 38
DQ5: Exceeded Timing Limits ................................................ 39
DQ3: Sector Erase Timer ....................................................... 39
DQ1: Write-to-Buffer Abort ..................................................... 39
Table 12. Write Operation Status................................................... 40
Absolute Maximum Ratings. . . . . . . . . . . . . . . . . 41
Figure 10. Maximum Negative Overshoot Waveform ................... 41
Figure 11. Maximum Positive Overshoot Waveform ..................... 41
Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . 41
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 42
Test Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Figure 12. Test Setup .................................................................... 43
Table 13. Test Specifications ......................................................... 43
Key to Switching Waveforms. . . . . . . . . . . . . . . . 43
Figure 13. Input Waveforms and Measurement Levels ................. 43
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 44
Read-Only Operations ........................................................... 44
Figure 14. Read Operation Timings ............................................... 44
Figure 15. Page Read Timings ...................................................... 45
Hardware Reset (RESET#) .................................................... 46
Figure 16. Reset Timings ............................................................... 46
Erase and Program Operations .............................................. 47
Figure 17. Reset Timings ............................................................... 48
Figure 18. Program Operation Timings .......................................... 49
Figure 19. Accelerated Program Timing Diagram .......................... 49
Figure 20. Chip/Sector Erase Operation Timings .......................... 50
Figure 21. Data# Polling Timings (During Embedded Algorithms) . 51
Figure 22. Toggle Bit Timings (During Embedded Algorithms) ...... 52
Figure 23. DQ2 vs. DQ6 ................................................................. 52
Temporary Sector Group Unprotect ....................................... 53
Figure 24. Temporary Sector Group Unprotect Timing Diagram ... 53
Figure 25. Sector Group Protect and Unprotect Timing Diagram .. 54
Alternate CE# Controlled Erase and Program Operations ..... 55
Figure 26. Alternate CE# Controlled Write (Erase/Program)
Operation Timings .......................................................................... 56
Latchup Characteristics . . . . . . . . . . . . . . . . . . . . 56
Erase And Programming Performance. . . . . . . . 57
TSOP Pin and BGA Package Capacitance . . . . . 58
Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 59
TS056/TSR056—56-Pin Standard/Reverse Thin Small Outline
Package (TSOP) ..................................................................... 59
LAA064—64-Ball Fortified Ball Grid Array
13 x 11 mm Package .............................................................. 60
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 61




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