TLC1078, TLC1078Y, TLC1079, TLC1079Y

LinCMOS

 µPOWER PRECISION

OPERATIONAL AMPLIFIERS

SLOS179A – FEBRUARY 1997 – REVISED MARCH 2001

3

POST OFFICE BOX 655303

TLC1087Y chip information

This chip, when properly assembled, displays characteristics similar to the TLC1078C. Thermal compression

or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips can be mounted with

conductive epoxy or a gold-silicon preform.

BONDING PAD ASSIGNMENTS

CHIP THICKNESS: 15 MILS TYPICAL

BONDING PADS: 4

× 4 MILS MINIMUM

TJmax = 150°C

TOLERANCES ARE

±10%.

ALL DIMENSIONS ARE IN MILS.

+

–

1OUT

1IN +

1IN –

VDD

VDD – /GND

(8)

(3)

(2)

(4)

+

–

2OUT

2IN +

2IN –

(5)

(6)

83

72

(1)

(5)

(4)

(3)

(2)

(6)

(7)

(8)

BONDING PAD ASSIGNMENTS