LMZ30602

SNVS997 – JULY 2013

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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ORDERING INFORMATION

For the most current package and ordering information, see the Package Option Addendum at the end of this datasheet, or see

the TI website at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

VALUE

UNIT

MIN

MAX

VIN, PWRGD

–0.3

7

V

INH/UVLO, RT/CLK

–0.3

3.3

V

Input Voltage

SS/TR, STSEL, VADJ

–0.3

3

V

SENSE+

VADJ rating must also be met

-0.3

VOUT

V

PH

–0.6

7

V

Output Voltage

PH 10ns Transient

–2

7

V

VOUT

-0.6

VIN

V

–0.2

0.2

V

RT/CLK, INH/UVLO

±100

µA

Source Current

PH

Current Limit

A

PH

Current Limit

A

Sink Current

SS/TR

±100

µA

PWRGD

10

mA

Operating Junction Temperature

–40

°C

Storage Temperature

–65

150

°C

Mechanical Shock

Mil-STD-883D, Method 2002.3, 1 msec, 1/2 sine, mounted

1500

G

Mechanical Vibration

Mil-STD-883D, Method 2007.2, 20-2000Hz

20

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

See the temperature derating curves in the Typical Characteristics section for thermal information.

THERMAL INFORMATION

LMZ30602

RKG39

UNIT

39 PINS

12

2.2

°C/W

9.7

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

The junction-to-ambient thermal resistance,

1 oz. copper and natural convection cooling. Additional airflow reduces

(3)

The junction-to-top characterization parameter,

the temperature of the top of the device.

(4)

The junction-to-board characterization parameter,

the temperature of the board 1mm from the device.

2

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