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SI-8001FDE 데이터시트(PDF) 5 Page - Sanken electric

부품명 SI-8001FDE
상세설명  DC-to-DC Step-Down Converter
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제조업체  SANKEN [Sanken electric]
홈페이지  http://www.sanken-ele.co.jp/en
Logo SANKEN - Sanken electric

SI-8001FDE 데이터시트(HTML) 5 Page - Sanken electric

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SANKEN ELECTRIC CO., LTD.
DC-to-DC Step-Down Converter
SI-8001FDE
27469.056
Thermal Performance Characteristics
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
–25
0
25
50
75
100
125
Power Dissipation versus Ambient Temperature
T
J(max) = 125°C; Mounted on glass-epoxy PCB (40 mm × 40 mm),
with varying exposed copper areas
TA (°C)
Cu Area: 1600 mm2
RθJA = 33.3°C/W
Cu Area: 800 mm2
RθJA = 37°C/W
Cu Area: 400 mm2
RθJA = 44°C/W
Cu Area: 100 mm2
RθJA = 53°C/W
Device Thermal Resistance versus Exposed Copper Area on PCB
Glass-epoxy PCB, 40 mm × 40 mm
Copper Area (mm2)
55
50
45
40
35
30
0
800
1000
1200
1400
1600
200
400
600
1800
6
5
4
3
2
1
0
0
20
40
60
80
100 120 140
180
160
TJ (°C)
Overtemperature
Protection:
Output Voltage versus
Junction Temperature
V
IN = 15 V, IO = 10 mA
OTP On
OTP Off
The application must be designed to ensure that the TJ(max)
of the device is not exceeded during operation. To do so, it is
necessary to determine values for maximum power dissipation,
PD(max), and ambient temperature, TA(max).
The relationships of TJ, PD, TA, and case temperature, TC, are as
shown in the following formulas:
TJ – TC
RθJC
PD =
TJ – TA
RθJA
PD =
and
.
PD can be calculated from input values:
⎟⎟
⎜⎜
⎟⎟
⎜⎜
=
IN
O
O
F
x
O
O
D
V
V
I
V
I
V
P
1
1
100
where:
VO is output voltage in V,
VIN is input supply voltage in V,
IO is output current in A,
ηx is IC efficiency in percent (varies with VIN and IO; refer to
efficiency performance curves for value), and
VF is forward voltage for the input diode, Di. In these tests, the
Sanken SPB-G56S was used, at 0.4 V. For application design,
obtain thermal data from the datasheet for the diode.
PD is substantially affected by the heat conductance properties of
the application, in particular any exposed copper area on the PCB
where the device is mounted. The relationships of PD, TA, and
copper area is represented in the Power Dissipation chart.
RθJA for a given copper area can be determined form the Device
Thermal Resistance chart. This can be substituted into the formula
above to determine the TJ (max) allowable in the application.
Generally, more than 10% to 20% derating is required.
Because the heat dissipation capacity of the copper area depends
substantively on how it is used in the actual application, thermal
characteristics of the application must be confirmed by testing.
TC is determined by connecting a thermocouple to the device as
shown here:
Thermocouple mount
at tab center
And analyzing the results using the following formula:
TJ = PD × RθJC + TC ,
for this device, RθJC is 3 °C/W.


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