전자부품 데이터시트 검색엔진
  Korean  ▼
ALLDATASHEET.CO.KR

X  

HLMP-D150 데이터시트(PDF) 7 Page - AVAGO TECHNOLOGIES LIMITED

부품명 HLMP-D150
상세설명  Minimum luminous intensity specified at 1 mA
Download  9 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
제조업체  AVAGO [AVAGO TECHNOLOGIES LIMITED]
홈페이지  http://www.avagotech.com
Logo AVAGO - AVAGO TECHNOLOGIES LIMITED

HLMP-D150 데이터시트(HTML) 7 Page - AVAGO TECHNOLOGIES LIMITED

  HLMP-D150 Datasheet HTML 1Page - AVAGO TECHNOLOGIES LIMITED HLMP-D150 Datasheet HTML 2Page - AVAGO TECHNOLOGIES LIMITED HLMP-D150 Datasheet HTML 3Page - AVAGO TECHNOLOGIES LIMITED HLMP-D150 Datasheet HTML 4Page - AVAGO TECHNOLOGIES LIMITED HLMP-D150 Datasheet HTML 5Page - AVAGO TECHNOLOGIES LIMITED HLMP-D150 Datasheet HTML 6Page - AVAGO TECHNOLOGIES LIMITED HLMP-D150 Datasheet HTML 7Page - AVAGO TECHNOLOGIES LIMITED HLMP-D150 Datasheet HTML 8Page - AVAGO TECHNOLOGIES LIMITED HLMP-D150 Datasheet HTML 9Page - AVAGO TECHNOLOGIES LIMITED  
Zoom Inzoom in Zoom Outzoom out
 7 / 9 page
background image
7
Precautions:
Lead Forming:
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
• For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
• If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder operation,
as the excess lead length also acts as small heat sink.
Soldering and Handling:
• Care must be taken during PCB assembly and soldering
process to prevent damage to the LED component.
• LED component may be effectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The closest
manual soldering distance of the soldering heat source
(soldering iron’s tip) to the body is 1.59mm. Soldering
the LED using soldering iron tip closer than 1.59mm
might damage the LED.
• ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
• Recommended soldering condition:
Wave
Manual Solder
Soldering[1],[2]
Dipping
Pre-heat Temperature 105°C Max.
Pre-heat Time
60 sec Max.
Peak Temperature
250°C Max.
260°C Max.
Dwell Time
3 sec Max.
5 sec Max.
Note:
1. Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2. It is recommended to use only bottom preheaters in order to
reduce thermal stress experienced by LED.
• Wave soldering parameters must be set and maintained
according to the recommended temperature and dwell
time. Customer is advised to perform daily check on the
soldering profile to ensure that it is always conforming
to recommended soldering conditions.
Note:
1. PCB with different size and design (component density) will
have different heat mass (heat capacity). This might cause a
change in temperature experienced by the board if same wave
soldering setting is used. So, it is recommended to re-calibrate
the soldering profile again before loading a new type of PCB.
2. Customer is advised to take extra precaution during wave
soldering to ensure that the maximum wave temperature
does not exceed 250°C and the solder contact time does not
exceeding 3sec. Over-stressing the LED during soldering process
might cause premature failure to the LED due to delamination.
• Any alignment fixture that is being applied during
wave soldering should be loosely fitted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during wave
soldering process.
• At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment fixture or pallet.
• If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using reflow soldering prior to insertion the TH LED.
• Recommended PC board plated through holes (PTH)
size for LED component leads.
LED Component
Lead Size
Diagonal
Plated Through-
Hole Diameter
Lead size (typ.) 0.45 × 0.45 mm
(0.018 × 0.018 in.)
0.636 mm
(0.025 in)
0.98 to 1.08 mm
(0.039 to 0.043 in)
Dambar shear-
off area (max.)
0.65 mm
(0.026 in)
0.919 mm
(0.036 in)
Lead size (typ.) 0.50 × 0.50 mm
(0.020 × 0.020 in.)
0.707 mm
(0.028 in)
1.05 to 1.15 mm
(0.041 to 0.045 in)
Dambar shear-
off area (max.)
0.70 mm
(0.028 in)
0.99 mm
(0.039 in)
• Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause difficulty inserting the TH LED.
Refer to application note AN5334 for more information
about soldering and handling of TH LED lamps.
1.59 mm


유사한 부품 번호 - HLMP-D150

제조업체부품명데이터시트상세설명
logo
QT Optoelectronics
HLMP-D150 QT-HLMP-D150 Datasheet
324Kb / 4P
   DOUBLE HETEROJUNCTION AIGAAS LOW CURRENT RED LED LAMPS
logo
Fairchild Semiconductor
HLMP-D150 FAIRCHILD-HLMP-D150 Datasheet
274Kb / 5P
   DOUBLE HETEROJUNCTION AIGaAs LOW CURRENT RED LED LAMPS
logo
Agilent(Hewlett-Packard...
HLMP-D150 HP-HLMP-D150 Datasheet
107Kb / 6P
   T-13/4 (5 mm), T-1 (3 mm), Low Current, Double Heterojunction AlGaAs Red LED Lamps
HLMP-D150 HP-HLMP-D150 Datasheet
387Kb / 7P
   T-13/4 (5 mm), T-1 (3 mm), Low Current, Double Heterojunction AlGaAs Red LED Lamps
logo
AVAGO TECHNOLOGIES LIMI...
HLMP-D150 AVAGO-HLMP-D150 Datasheet
316Kb / 9P
   T-13/4 (5 mm), T-1 (3 mm), Low Current, Double Heterojunction AlGaAs Red LED Lamps
More results

유사한 설명 - HLMP-D150

제조업체부품명데이터시트상세설명
logo
OSRAM GmbH
LRTGFTM-S7T7-1-V7AW-29 OSRAM-LRTGFTM-S7T7-1-V7AW-29 Datasheet
403Kb / 24P
   luminous intensity
LUWG5AP-5D5E-BG-P4P6-LH OSRAM-LUWG5AP-5D5E-BG-P4P6-LH Datasheet
396Kb / 17P
   luminous intensity
logo
HB Electronic Component...
PLCC4XRGBCT HB-PLCC4XRGBCT Datasheet
2Mb / 10P
   High luminous Intensity
logo
P-tec Corporation
PL5050A6-WCR50 P-TEC-PL5050A6-WCR50 Datasheet
401Kb / 7P
   High luminous intensity
logo
Vishay Siliconix
VLMW21 VISHAY-VLMW21 Datasheet
333Kb / 10P
   Luminous intensity categorized
Rev. 1.4, 09-Feb-10
TLUR2400 VISHAY-TLUR2400 Datasheet
763Kb / 5P
   Luminous intensity categorized
Rev. 1.5, 22-Apr-13
logo
Sanken electric
SECU1B07C SANKEN-SECU1B07C Datasheet
203Kb / 10P
   High Luminous Intensity
logo
Vishay Siliconix
TLHG44K1L2 VISHAY-TLHG44K1L2 Datasheet
109Kb / 5P
   Luminous intensity categorized
Rev. 1.2, 14-Oct-14
TLCR6800 VISHAY-TLCR6800 Datasheet
470Kb / 5P
   High luminous intensity
Rev. 1.1, 29-Apr-13
logo
Lite-On Technology Corp...
LTL5V3SSS LITEON-LTL5V3SSS Datasheet
558Kb / 10P
   High luminous intensity output
More results


Html Pages

1 2 3 4 5 6 7 8 9


데이터시트 다운로드

Go To PDF Page


링크 URL




개인정보취급방침
ALLDATASHEET.CO.KR
ALLDATASHEET 가 귀하에 도움이 되셨나요?  [ DONATE ] 

Alldatasheet는?   |   광고문의   |   운영자에게 연락하기   |   개인정보취급방침   |   링크교환   |   제조사별 검색
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com